73TI1150SE00J Kemet, 73TI1150SE00J Datasheet - Page 8

73TI1150SE00J

Manufacturer Part Number
73TI1150SE00J
Description
Manufacturer
Kemet
Datasheet

Specifications of 73TI1150SE00J

Tolerance (+ Or -)
5%
Voltage
1600VDC/450VAC
Temp Coeff (dielectric)
PLYP
Mounting Style
Through Hole
Construction
Radial
Failure Rate
Not Required
Seated Plane Height
11mm
Product Diameter (mm)
Not Requiredmm
Product Height (mm)
11mm
Product Depth (mm)
5mm
Product Length (mm)
18mm
Lead Spacing (nom)
15mm
Lead Diameter (nom)
0.8mm
Operating Temp Range
-55C to 105C
Capacitance
1500pF
Package / Case
Not Required
Lead Free Status / RoHS Status
Compliant
eleCTRICAl CHARACTeRISTICS
Rated voltage (V
100 Vdc - 160 Vdc - 250 Vdc - 400 Vdc
for 1 section.
630 Vdc - 1000 Vdc - 1250 Vdc - 1600 Vdc - 2000 Vdc
for 2 sections.
Rated temperature (T
Temperature derated voltage:
for temperatures between +85°C and +105°C a decreasing
factor of 1.25% per degree °C on the rated voltage V
(d.c. and a.c.), has to be applied.
Capacitance range
0.010µF to 0.15µF
100pF to 2.2 µF
Capacitance values:
e6 series (IeC 60063 Norm)
e12 series (IeC 60063 Norm)
Capacitance tolerances (measured at 1 kHz):
±5% (J); ±10% (K)
±2.5% (H); ±5% (J); ±10% (K)
Total self inductance (l):
(Leads length ~2 mm)
Dissipation factor (DF):
tgδ 10
Insulation resistance:
Test voltage between terminations:
2.5xV
2.0xV
applied for 2 s at 25°C± 5°C
09/2008
Pitch (mm)
L (nH)
kHz
Test conditions
Temperature:
Voltage charge time:
Voltage charge:
Performance
≥1x10
≥30000 s
*Typical value
for 1 section and 2 sections (values <1nF)
for 2 sections (values >1nF)
100
R
R
10
-4
1
at +25°C ±5°C
5
MΩ
C≤0.1
≤03
≤04
≤10
15
10
µ
R
for C≤0.33µF (5x10
for C>0.33µF (150000 s)*
for 1 section
for 2 sections
):
F
22.5
1 section
2 sections
18
R
):
0.1
µ
27.5
F<C≤1.0
18
+85°C
≤3
≤6
+25°C±5°C
1 min
100Vdc
37.5
20
for 1 section
for 2 sections
µ
F
5
MΩ)*
C>1
≤3
µ
F
R
86
FIlM-FOIl POlyPROPylene CAPACITOR
HIgH CURRenT APPlICATIOnS
PRoDUCT CoDe: R73
TeST MeTHOD AnD PeRFORMAnCe
Damp heat, steady state:
endurance:
Resistance to soldering heat:
long term stability (after two years):
Test conditions
Temperature:
Relative humidity (RH):
Test duration:
Performance
Capacitance change |∆C/C|: ≤2%
DF change (∆tgδ):
Insulation resistance:
Test conditions
Temperature:
Test duration:
Voltage applied:
Performance
Capacitance change |∆C/C|: ≤2%
DF change (∆tgδ):
Insulation resistance:
Test conditions
solder bath temperature:
Dipping time (with heat screen):10 s±1 s
Performance
Capacitance change |∆C/C| ≤1%
DF change (∆tgδ):
Insulation resistance:
Storage:
Performance
Capacitance change |∆C/C|:
standard environmental conditions (see page 12).
+40°C±2°C
93% ±2%
56 days
≤5x10
≥50% of initial limit.
+85°C±2°C
1000 h
1.5xV
≤5x10
≥50% of initial limit.
+260°C±5°C
≤5x10
≥ initial limit.
0.5%
.
R
-4
-4
-4
at 1KHz
at 1KHz
at 1KHz
R73
KP series

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