NSWC823J50TRD3F NIC Components, NSWC823J50TRD3F Datasheet

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NSWC823J50TRD3F

Manufacturer Part Number
NSWC823J50TRD3F
Description
Manufacturer
NIC Components
Datasheet

Specifications of NSWC823J50TRD3F

Tolerance (+ Or -)
5%
Voltage
50VDC
Temp Coeff (dielectric)
PLYETH
Mounting Style
Surface Mount
Construction
SMT Chip
Failure Rate
Not Required
Seated Plane Height
Not Requiredmm
Product Diameter (mm)
Not Requiredmm
Product Height (mm)
2.4mm
Product Depth (mm)
3.3mm
Product Length (mm)
4.8mm
Lead Spacing (nom)
Not Requiredmm
Lead Diameter (nom)
Not Requiredmm
Operating Temp Range
-55C to 105C
Capacitance
.082uF
Package / Case
1913
Lead Free Status / RoHS Status
Compliant
Stacked Film Capacitor Chips
FEATURES
• STACKED METALLIZED POLYETHYLENE NAPHTHALATE (PEN) FILM
• STANDARD EIA 1206, 1210, 1913, 2416, 2820, 3022 AND 3925 SIZES
• WIDE TEMPERATURE RANGE UP TO +105
• HIGH HEAT AND MOISTURE RESISTANT
• VERY STABLE TEMPERATURE, FREQUENCY, VOLTAGE, BIAS AND
nDIELECTRIC ABSORPTION CHARACTERISTICS
• REFLOW SOLDERING ONLY
• TAPE AND REEL PACKAGING
ENVIRONMENTAL CHARACTERISTICS
RECOMMENDED LAND
PATTERN (mm)
NIC COMPONENTS CORP.
EIA Size
Insulation resistance (20°C)
Temperature Characteristic
(500 Hours for 100Vdc, 0.012µF ~ 1.0µF)
1206
1210
1913
2416
2820
3022
3925
Dissipation factor (20°C)
1,000 Hours at 125% of Rated Voltage
Capacitance Tolerance
Dielectric Withstanding
(125°C for 100Vdc, 0.012µF ~ 1.0µF)
Humidity Load Life (90% ~ 95% RH)
Dielectric Absorption
Temperature Range
Capacitance Range
SPECIFICATIONS
Votage Ratings
Resistance to Soldering Heat:
25% Wt Rosin-Methanol Flux
®
(1) 1,000 Hours, +40°C
Voltage
(2) 500 Hours, +60°C
1.8
1.8
2.6
3.8
4.5
5.1
7.2
Life Test At +105°C
A
B
A
Solderability with
+240°C Peak
11.9
3.6
3.6
6.6
7.8
9.0
9.7
B
1.4
2.3
3.0
3.8
4.6
5.0
5.7
C
0.001 ~ 0.0047µF 0.00561 ~ 0.01µF 0.012 ~ 0.22µF 0.1 ~ 0.47µF 0.18 ~ 0.33µF 0.39 ~ 0.47µF 0.56 ~ 1.0µF
www.niccomp.com
1206
NSWC 104 J 50 TR D4 N F
PART NUMBER SYSTEM
Insulation Resistance
Insulation Resistance
Insulation Resistance
Capacitance Change
Capacitance Change
Capacitance Change
Dissipation Factor
Dissipation Factor
Dissipation Factor
300
250
200
150
100
90% Minimum Coverage After 2.5 Second Dip Into 245°C Solder Pot
O
50
25
Series
0
-55°C ~ +125°C (100Vdc, 0.012µF ~ 1.0µF with derating above +85°C)
C (16Vdc & 50Vdc)
1210
25°C ~ 150°C
0.012 ~ 0.15µF 5% (J) or 10% (K), 0.18 ~ 1.0µF 10% (K) only
90 sec. max.
-55°C ~ +105°C (16Vdc, 50Vdc and 100V 0.012µF ~ 0.01µF)
175% of Rated Voltage for 5 Seconds (except 100Vdc parts)
RECOMMENDED REFLOW PROFILE
Ramp-up
Capacitance in pF, 1st two digits are
signifi cant, 3rd digit is no. of zeros
16V and 50V ±5% (J), 100V 0.001 ~ 0.01µF 5% (J) only,
www.lowESR.com
Tolerance Code: J=±5%
±3% ∆C Maximum Over Temperature Range
Voltage
3 Gigohms or 1000Ω/F whichever is lower
*Special packaging and handling required.
Tape & Reel
150% of Rated Voltage 60 Seconds
(16Vdc parts measured at 10Vdc)
150°C ~ 180°C
(1) +8%/-5%
(1) 1.5% Max.
120 sec. max.
Pre-heat
Size Code
1 Gigohm Minimum or 300Ω/F whichever is lower
1 Gigohm Minimum or 300Ω/F whichever is lower
1913
16Vdc, 50Vdc, 100Vdc
Optional High Temp. Refl ow (+250°C)*
0.05 ~ 0.10% Typical
*See Part Number System for Details
Time
1.0% max. @ 1KHz
RoHS Compliant
includes all homogeneous materials
Case Sizes
Within +1%/-6% of Initial Value
(1) 100 Megohm Min. or 30Ω/F
(2) 10 Megohm Min. or 3Ω/F
Within ±5% of Initial Value
Time above 220°C
www.RFpassives.com
60 sec. max.
Compliant
whichever is lower
2416
1.1% Maximum
1.1% Maximum
RoHS
(2) ±10% of Initial Value
(2) 2.0% Max.
FOR NEW DESIGNS
RECOMMENDED
Standard: +240 °C Peak Temperature
Cool Down
NSWC IS
2820
(see part numbering system)
+250°C Special Order
www.SMTmagnetics.com
3022
NSWC Series
3925
49

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NSWC823J50TRD3F Summary of contents

Page 1

... A B ® NIC COMPONENTS CORP. www.niccomp.com O C (16Vdc & 50Vdc) Compliant includes all homogeneous materials *See Part Number System for Details Case Sizes 1210 1913 16Vdc, 50Vdc, 100Vdc 16V and 50V ±5% (J), 100V 0.001 ~ 0.01µF 5% (J) only, 0.012 ~ 0.15µ ...

Page 2

... E3 5.5 7.4 4.7 Q1, Q2 6.91 8.43 5.685 0.343 ±0.013 8.94 10.54 5.795 ® NIC COMPONENTS CORP. www.niccomp.com 50 Fig. 1 16V & 50V, 100V D1~R8 Stacked Element Terminations: 95.5% Sn and 0.5% Cu over phosphorus copper barrier over copper base Fig. 2 (100V B2~C3) ...

Page 3

... Pre-heat 25 Ramp-up 150°C ~ 180°C 25°C ~ 150°C 120 sec. max. 90 sec. max. 0 Time ® NIC COMPONENTS CORP. www.niccomp.com *See Part Number System for Details Case Sizes 2416 2420 0.012 ~ 0.068µF 0.027 ~ 0.12µF 250Vdc ±5%(J) -55°C ~ +85°C 1 ...

Page 4

... D3, D4 3.4 ±0.05 E1, E2 2.7 4.6 6.3 E3 5.5 6.3 4.7 EMBOSSED PLASTIC CARRIER 1.5 +0 ® NIC COMPONENTS CORP. www.niccomp.com 52 Fig. 1 Stacked Element Terminations: 95.5% Sn and 0.5% Cu over phosphorus copper barrier over copper base W±0.3 F P±0.1 D+0.2/-0 Qty/Reel 3,000 1 ...

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