BLM18AG102SN1 Murata, BLM18AG102SN1 Datasheet - Page 181

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BLM18AG102SN1

Manufacturer Part Number
BLM18AG102SN1
Description
Manufacturer
Murata
Datasheet

Specifications of BLM18AG102SN1

Mounting Style
Surface Mount
Termination
Flat Style
Operating Temp Range
-55C to 125C
Current Rating (max)
0.4A
Product Height (mm)
0.8mm
Product Depth (mm)
0.8mm
Product Length (mm)
1.6mm
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BLM18AG102SN1B
Manufacturer:
MURATA
Quantity:
240 000
Part Number:
BLM18AG102SN1D
Manufacturer:
MURATA
Quantity:
450
Part Number:
BLM18AG102SN1D
Manufacturer:
MURATA
Quantity:
8 000
Part Number:
BLM18AG102SN1D
Manufacturer:
MURATA/村田
Quantity:
20 000
Part Number:
BLM18AG102SN1J
Manufacturer:
MURATA
Quantity:
240 000
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
NFA18S
NFA21S
NFA31G
NFA31C
NFW31S
NFE31P
NFE61P
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Chip mounting side
Reflow Soldering
R0.1 to R0.2 is preferred to obtain
high voltage withstanding
o Reflow Soldering NFA31G/31C
o Reflow Soldering
Chip mounting side
2.0
4.8
8.8
Small diameter thru hole ø0.4
0.05
0.5
0.175
0.3
0.225
NFA18S
1.375
2.35
0.4
1.3
2.0
2.6
3.8
4.2
0.8 Pitch
Filled via
ø0.1
ø0.4
EMIFILr (Soldering and Mounting)
Small diameter thru hole ø0.2
Chip mounting side
o Reflow and Flow NFW31S
o Reflow Soldering NFE31P
o Flow Soldering
Chip mounting side
Small diameter thru hole ø0.4
1.5
3.8
4.8
9.0
Small diameter thru hole ø0.4
0.6
1.2
2.2
4.2
NFA21S
0.25
Continued on the following page.
2.5
1.5
0.25
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
(in mm)
179
C31E.pdf
08.9.1
6

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