2NBS14-RJ2-823LF Bourns Inc., 2NBS14-RJ2-823LF Datasheet - Page 2

2NBS14-RJ2-823LF

Manufacturer Part Number
2NBS14-RJ2-823LF
Description
Manufacturer
Bourns Inc.
Type
Networkr
Datasheet

Specifications of 2NBS14-RJ2-823LF

Technology
Thin Film
Resistance
82kohm
Power Rating
1W
Power Rating Per Resistor
1/10W
Number Of Resistors
13
Tolerance (+ Or -)
5%
Circuit Designator
BUS
Package / Case
SOIC
Mounting Style
Surface Mount
Temperature Coefficient
±100
Military Standard
Not Required
Operating Temp Range
-55C to 125C
No. Of Terminals
14
Case Style
Molded
Failure Rate
Not Required
Termination Style
Gull Wing
Terminal Pitch
1.27
Product Length (mm)
8.74mm
Product Depth (mm)
5.8mm
Product Height (mm)
1.75mm
Lead Free Status / RoHS Status
Compliant
Mechanical Characteristics
QSOP Package Dimensions
Thin Film on Silicon 2QSP / 2NBS -XX2 Bussed Resistors
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MO-137.
(.150 - .157)
3.81 - 3.99
2QSP16
2QSP20
2QSP24
2QSP28
Model
PIN 1
0-8 °
(.053 - .069)
1.35 - 1.75
(.004 - .010)
.10 - .25
(.228 - .244)
5.80 - 6.20
4.80 - 4.98 (.189 - .196)
8.56 - 8.74 (.337 - .344)
8.56 - 8.74 (.337 - .344)
9.80 - 9.98 (.386 - .393)
(.025)
.635
A
(.008 - .012)
TYP.
.21 - .31
A
(.007 - .010)
(.016 - .050)
.41 - 1.27
.19 - .25
Narrow-Body SOIC Package Dimensions
Customers should verify actual device performance in their specific applications.
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MS-012.
(.150 - .157)
3.81 - 3.99
2NBS08
2NBS14
2NBS16
Model
PIN 1
0-8 °
(.053 - .069)
1.35 - 1.75
(.004 - .010)
.10 - .25
(.228 - .244)
4.80 - 4.98 (.189 - .196)
8.56 - 8.74 (.337 - .344)
9.80 - 9.98 (.386 - .393)
Specifications are subject to change without notice.
5.80 - 6.20
(.050)
(.014 - .018)
1.27
0.36 - 0.46
A
TYP.
A
(.007 - .010)
(.016 - .050)
.41 - 1.27
.19 - .25

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