1FHR,64,50A/P,S,C,S08,09,10

 

1-146893-1

Manufacturer Part Number1-146893-1
Description1FHR,64,50A/P,S,C,S08,09,10
ManufacturerTE Connectivity
TypeIEEE 1386
1-146893-1 datasheets

Availability: By request

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Warranty: 60 days

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Specifications of 1-146893-1

GenderRCPNumber Of Contacts64POS
Contact MaterialCopper AlloyContact PlatingGold Over Nickel
Number Of Ports1PortBody OrientationStraight
Pitch (mm)1mmNumber Of Terminals64
Housing MaterialThermoplasticMounting StyleSurface Mount
Termination MethodSolderCurrent Rating (max)0.5/ContactA
Pcb Mount RetentionWithPcb Mount AlignmentWith
Product TypeConnectorConnector TypeConnector Assembly
Product Line1mm FHUl File NumberE28476
Csa File NumberLR7189Termination Method To Pc BoardSurface Mount
Pcb Mounting OrientationVerticalPcb Mount Alignment TypeLocating Posts
Contact - Rated Current (a)0.8Operating Voltage ReferenceAC/DC
Operating Voltage (vac)250Operating Voltage (vdc)250
Tail Length (mm [in])2.05 [0.081]Tail OrientationIn-line
Profile Height (y-axis) (mm [in])5.37 [0.211]Number Of Positions64
Number Of Columns32Centerline (mm [in])1.00 [0.039]
Underplate Material Thickness (µm [?in])1.27 [50.000]Length (x-axis) (mm [in])34.22 [1.347]
Width (z-axis) (mm [in])6.04 [0.238]Number Of Rows2
Pcb Mount Retention TypeLocating PostsMating RetentionWithout
Contact Base MaterialPhosphor BronzeContact Plating, Mating Area, MaterialGold
Contact Plating, Mating Area, Thickness (µm [?in])1.27 [50]Tail Plating MaterialTin-Lead
Tail Plating, Thickness (µm [?in])3.81 [150]Underplate MaterialNickel
Contact DesignSingle BeamPitch (mm [in])16.00 [0.630]
Tin To Lead Ratio93 / 7Connector StyleReceptacle
Ul Flammability RatingUL 94V-0Housing ColorBlack
Mating AlignmentWithoutStack Height (mm [in])10.00 [0.394], 8.00 [0.315], 9.00 [0.354]
Differential SignalingWithRohs/elv ComplianceELV compliant, 5 of 6 Compliant
Lead Free Solder ProcessesReflow solder capable to 245°C, Reflow solder capable to 260°CIndustry StandardIEEE 1386 Mezzanine Connector
Agency/standardUL, CSAUl RatingListed
Csa CertifiedYesOperating Temperature (°c [°f])-55 – +110 [-67 – +230]
Applies ToPrinted Circuit BoardBoard-to-board ConfigurationMezzanine
Pick And Place CoverWithApplication UseBoard-to-Board
Contact Transmits (typical Application)Signal (Data)Packaging MethodTape & Reel
Lead Free Status / RoHS StatusNot Compliant  
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Product Details for 1
- 146893 - 1
.4mm, .5mm, .6mm, .8mm, 1mm, Fine
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Connectors
Alternates/Compliance Statement)
1 - 146893
- 1
Product Highlights:
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Documentation & Additional Information
Product Drawings:
RECEPTACLE ASSY, W/ VACUUM COVER, 1.0mm FH(IEEE 1386...
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(PDF, English)
Catalog Pages/Data Sheets:
None Available
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Product Specifications:
None Available
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Application Specifications:
None Available
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Instruction Sheets:
None Available
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CAD Files: (
CAD Format & Compression Information
3D Model
(STEP, Version J)
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3D Model
(IGES, Version J)
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2D Drawing
(DXF, Version J)
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Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
Product Type
= Receptacle
?
Number of Positions
= 64
?
PCB Mount Angle = Vertical
?
Keyed
= No
?
Comment = IEEE 1386 Mezzanine Connector.
?
Body Related Features:
Centerline (mm [in])
= 1.00 [0.039]
?
Board - to - Board Stack Height (mm [in])
?
[0.315], 9.00 [0.354], 10.00 [0.394]
Locating Posts
= With
?
Vacuum Cover
= With
?
Number of Rows = Dual
?
Contact Related Features:
Family Name = Free Height
?
Contact Layout
= In - Line
?
Contact Material = Copper Alloy
?
Contact Mating Area Plating
?
Contact Termination Area Plating = Tin
?
over Nickel
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5 of 6 RoHS/ELV Compliant
(Find RoHS Compliant
Receptacle
Family Name = Free Height
1.00 mm Centerline
Number of Positions = 64
In - Line Contact Layout
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List all Documents
Housing Related Features:
Industry Standards:
= 8.00
Packaging Related Features:
= Gold (50)
Other:
- Lead
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Mating Products (18)
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Housing Color = Black
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Housing Material = High Temperature
?
Thermoplastic
Housing Flammability Rating = UL 94V
?
Housing Material Temperature = High
?
RoHS/ELV Compliance
= ELV compliant, 5 of 6
?
Compliant
Lead Free Solder Processes
?
capable to 240°C, Wave solder capable to 260°
C, Wave solder capable to 265°C, Reflow
solder capable to 245°C, Reflow solder capable
to 260°C, Pin - in - Paste capable to 245°C, Pin
in - Paste capable to 260°C
Packaging Method
= Tape & Reel
?
Brand = AMP
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