5050871-1 TE Connectivity, 5050871-1 Datasheet

5050871-1

Manufacturer Part Number

5050871-1

Description

DISCRETE SOCKET, PC BOARD

Manufacturer

TE Connectivity

Type

Discrete Socketr

Datasheet

1.5050871-1.pdf (1 pages)

Specifications of 5050871-1

Number Of Contacts

1POS

Row Spacing (mm)

Not Requiredmm

Pitch (mm)

Not Requiredmm

Grid Size

Not Required

Contact Plating

Gold

Mounting Style

Surface Mount

Contact Material

Beryllium Copper

Product Depth (mm)

3mm

Product Length (mm)

7.32mm

Gender

SKT

Body Orientation

Straight

Connector Type

PCB Socket

No. Of Contacts

Contact Termination

Through Hole

Body Material

Copper

Socket Mounting

PC Board

Rohs Compliant

Yes

Socket Length (mm [in])

7.32 [0.288]

Sleeve Style

Open Bottom

Sealant

Without

Sleeve Material

Copper

Recommended Hole Size (mm [in])

2.59 [0.102]

Mating Pin Dia. Range (mm [in])

1.07 – 1.24 [0.042 – 0.049]

Sleeve Material Plating

Tin

Spring Material

Beryllium Copper

Contact Spring Plating

Gold (30)

Contact Base Material

Beryllium Copper

Insertion Method

Hand/Semi-Automatic

Government/industry Qualification

Rohs/elv Compliance

RoHS compliant, ELV compliant

Lead Free Solder Processes

Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C, Reflow solder capable to 245°C, Reflow solder capable to 260°C, Pin-in-Paste capable to 245°C, Pin-in-Paste capable to 260°C

Rohs/elv Compliance History

Always was RoHS compliant

Application

Production

Packaging Method

Loose Piece

Lead Free Status / RoHS Status

Compliant

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Product Details for 5050871

Documentation & Additional Information

Product Drawings:

Catalog Pages/Data Sheets:

Product Specifications:

Application Specifications:

Instruction Sheets:

CAD Files:

Product Features

Product Type Features:

Body Related Features:

Contact Related Features:

Products

5050871

Products

MINIATURE SPRING SOCKET ASSEMBLY SERIES 5

None Available

Product Type = Socket

Socket Length (mm [in])

Sleeve Style

Sealant

Sleeve Material = Copper

Recommended Hole Size (mm [in]) = 2.59

[0.102]

Mating Pin Dia. Range (mm [in])

[0.042 – 0.049]

Spring Material = Beryllium Copper

Sleeve Plating

Contact Spring Plating

Contact Material

Documentation

Active

Languages

By Type

= Without

- 1

= Open Bottom

(Please use the Product Drawing for all design activity)

: English |

= Tin

Sockets/Memory Card Products

= Beryllium Copper

Resources

Home

Discrete Sockets

Product Highlights:

Deutsch

= Gold (30)

RoHS Compliant (Statement of Compliance)

Socket

Mating Pin Dia. Range = 1.07

Socket Length = 7.32 mm

Sleeve Style = Open Bottom

Tin Sleeve Plating

View all Features

Customer Support

= 7.32 [0.288]

- 1

Español

My Account

= 1.07

Português (do Brasil)

Country Sites

Supplier

Product Feature Selector

Customer Support

– 1.24

List all Documents

Site Map

China

Configuration Related Features:

Industry Standards:

Operation/Application:

Packaging Related Features:

Other:

(PDF, English)

???????

- 1.24

Japan

Insertion Method

Government/Industry Qualification = No

RoHS/ELV Compliance

compliant

Lead Free Solder Processes

capable to 240°C, Wave solder capable to 260°

C, Wave solder capable to 265°C, Reflow

solder capable to 245°C, Reflow solder capable

to 260°C, Pin - in - Paste capable to 245°C, Pin

in - Paste capable to 260°C

RoHS/ELV Compliance History = Always was

RoHS compliant

Application = Production

Packaging Method

Brand = AMP

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