H11G2VM Fairchild Semiconductor, H11G2VM Datasheet

Transistor Output Optocouplers Photodarlington

H11G2VM

Manufacturer Part Number
H11G2VM
Description
Transistor Output Optocouplers Photodarlington
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of H11G2VM

Maximum Input Diode Current
60 mA
Maximum Reverse Diode Voltage
6 V
Output Device
Phototransistor
Output Type
DC
Configuration
1 Channel
Input Type
DC
Maximum Collector Emitter Voltage
80 V
Maximum Collector Emitter Saturation Voltage
1 V
Isolation Voltage
5300 Vrms
Maximum Forward Diode Voltage
1.5 V
Maximum Power Dissipation
260 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Package / Case
PDIP-6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
©2007 Fairchild Semiconductor Corporation
H11G1M, H11G2M, H11G3M Rev. 1.0.4
H11G1M, H11G2M, H11G3M
High Voltage Photodarlington Optocouplers
Features
Applications
Schematic
High BV
– Minimum 100V for H11G1M
– Minimum 80V for H11G2M
– Minimum 55V for H11G3M
High sensitivity to low input current
(Min. 500% CTR at I
Low leakage current at elevated temperature
(Max. 100µA at 80°C)
Underwriters Laboratory (UL) recognized
File # E90700, Volume 2
IEC 60747-5-2 approved (ordering option V)
CMOS logic interface
Telephone ring detector
Low input TTL interface
Power supply isolation
Replace pulse transformer
CATHODE
ANODE
N/C
CEO
1
2
3
F
= 1mA)
6 BASE
5
4
COLLECTOR
EMITTER
Package Outlines
General Description
The H11GXM series are photodarlington-type optically
coupled optocouplers. These devices have a gallium
arsenide infrared emitting diode coupled with a silicon
darlington connected phototransistor which has an inte-
gral base-emitter resistor to optimize elevated tempera-
ture characteristics.
September 2009
www.fairchildsemi.com

Related parts for H11G2VM

H11G2VM Summary of contents

Page 1

... Schematic ANODE 1 CATHODE 2 3 N/C ©2007 Fairchild Semiconductor Corporation H11G1M, H11G2M, H11G3M Rev. 1.0.4 General Description The H11GXM series are photodarlington-type optically coupled optocouplers. These devices have a gallium arsenide infrared emitting diode coupled with a silicon darlington connected phototransistor which has an inte- gral base-emitter resistor to optimize elevated tempera- ture characteristics ...

Page 2

... LED Power Dissipation @ T D Derate Above 25°C DETECTOR V Collector-Emitter Voltage CEO H11G1M H11G2M H11G3M P Photodetector Power Dissipation @ T D Derate Above 25°C ©2007 Fairchild Semiconductor Corporation H11G1M, H11G2M, H11G3M Rev. 1.0.4 Parameter = 25° 25° 25° Value Units -40 to +150 °C -40 to +100 ° ...

Page 3

... ON t Turn-off Time OFF Isolation Characteristics Symbol Characteristic V Isolation Voltage ISO R Isolation Resistance ISO C Isolation Capacitance ISO *All Typical values 25°C A ©2007 Fairchild Semiconductor Corporation H11G1M, H11G2M, H11G3M Rev. 1.0 25°C unless otherwise specified.) A Test Conditions Device I = 10mA 10µ 0V 1MHz 1V 1MHz ...

Page 4

... Max. Working Insulation Voltage IORM V Highest Allowable Over Voltage IOTM External Creepage External Clearance Insulation Thickness RIO Insulation Resistance at Ts, V ©2007 Fairchild Semiconductor Corporation H11G1M, H11G2M, H11G3M Rev. 1.0.4 Parameter , 100% Production Test PR , Type and Sample Test = 500V IO 4 Min. Typ. ...

Page 5

... F Fig. 3 Output Current vs. Collector - Emitter Voltage 100 Normalized to 1mA 25˚ 0.1 0. – COLLECTOR – EMITTER VOLTAGE (V) CE ©2007 Fairchild Semiconductor Corporation H11G1M, H11G2M, H11G3M Rev. 1.0.4 Fig. 2 Normalized Output Current vs. Temperature 100 10 Normalized to 1mA F 1 0.1 0.01 -60 10 1000 I = 50mA F 100 ...

Page 6

... Surface Mount 6.10–6.60 8.43–9.90 3.28–3.53 5.08 (Max.) 0.38 (Min.) Note: All dimensions in mm. ©2007 Fairchild Semiconductor Corporation H11G1M, H11G2M, H11G3M Rev. 1.0.4 0.4" Lead Spacing 6.10–6.60 7.62 (Typ.) 5.08 (Max.) 0.38 (Min.) 0.20–0.30 15° (Typ.) (0.86) 1.02– ...

Page 7

... SR2V Marking Information Definitions ©2007 Fairchild Semiconductor Corporation H11G1M, H11G2M, H11G3M Rev. 1.0.4 Order Entry Identifier (Example) H11G1M Standard Through Hole Device H11G1SM Surface Mount Lead Bend H11G1SR2M Surface Mount; Tape and Reel H11G1TM 0.4" Lead Spacing H11G1VM VDE 0884 H11G1TVM VDE 0884, 0.4" ...

Page 8

... Reflow Profile 300 280 260 240 220 200 180 160 C 140 120 100 ©2007 Fairchild Semiconductor Corporation H11G1M, H11G2M, H11G3M Rev. 1.0.4 12.0 0.1 2.0 0.05 0.05 4.0 0.1 10.1 0.20 183 Sec 1.822 C/Sec Ramp up rate 33 Sec 60 120 180 Time (s) 8 Ø ...

Page 9

... TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended exhaustive list of all such trademarks. Auto-SPM™ F-PFS™ Build it Now™ FRFET CorePLUS™ Global Power Resource CorePOWER™ ...

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