MOC217R1VM Fairchild Semiconductor, MOC217R1VM Datasheet

Transistor Output Optocouplers Optocoupler Phototransistor

MOC217R1VM

Manufacturer Part Number
MOC217R1VM
Description
Transistor Output Optocouplers Optocoupler Phototransistor
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of MOC217R1VM

Maximum Input Diode Current
60 mA
Maximum Reverse Diode Voltage
6 V
Output Device
Phototransistor
Output Type
DC
Configuration
1 Channel
Input Type
DC
Maximum Collector Emitter Voltage
30 V
Maximum Collector Emitter Saturation Voltage
0.4 V
Isolation Voltage
2500 Vrms
Maximum Forward Diode Voltage
1.3 V
Maximum Collector Current
150 mA
Maximum Power Dissipation
250 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Package / Case
SOIC-8 Narrow
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MOC217R1VM
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
©2005 Fairchild Semiconductor Corporation
MOC215M, MOC216M, MOC217M Rev. 1.0.1
MOC215M, MOC216M, MOC217M
Small Outline Surface Mount Phototransistor
Optocouplers
Features
Applications
Schematic
U.L. recognized (File #E90700, Volume 2)
VDE recognized (File #136616)
(add option “V” for VDE approval, i.e, MOC205VM)
Convenient plastic SOIC-8 surface mountable
package style
Low LED input current required for easier logic
interfacing
Standard SOIC-8 footprint, with 0.050" lead spacing
Compatible with dual wave, vapor phase and
IR reflow soldering
High input-output isolation of 2500 V
guaranteed
Low power logic circuits
Interfacing and coupling systems of different
potentials and impedances
Telecommunications equipment
Portable electronics
CATHODE
ANODE
N/C
N/C
1
2
3
4
8
7
6
5
AC(rms)
N/C
BASE
COLLECTOR
EMITTER
Description
These devices consist of a gallium arsenide infrared
emitting diode optically coupled to a monolithic silicon
phototransistor detector, in a surface mountable, small
outline, plastic package. They are ideally suited for high
density applications, and eliminate the need for through-
the-board mounting.
Marking Information
MOC215M = 215
MOC216M = 216
MOC217M = 217
www.fairchildsemi.com
April 2009

Related parts for MOC217R1VM

MOC217R1VM Summary of contents

Page 1

... CATHODE 2 N/C 3 N/C 4 ©2005 Fairchild Semiconductor Corporation MOC215M, MOC216M, MOC217M Rev. 1.0.1 Description These devices consist of a gallium arsenide infrared emitting diode optically coupled to a monolithic silicon phototransistor detector surface mountable, small outline, plastic package. They are ideally suited for high density applications, and eliminate the need for through- the-board mounting ...

Page 2

... Storage Temperature Range stg Notes: 1. Isolation Surge Voltage internal device dielectric breakdown rating. ISO 2. For this test, Pins 1 and 2 are common and Pins 5, 6 and 7 are common. ©2005 Fairchild Semiconductor Corporation MOC215M, MOC216M, MOC217M Rev. 1.0 25°C Unless otherwise specified) A Rating = 25° 25° ...

Page 3

... For this test, Pins 1 and 2 are common and Pins 5, 6 and 7 are common rating of 2500 V for min. is equivalent to a rating of 3,000 V ISO AC(rms) 4. Current Transfer Ratio (CTR ©2005 Fairchild Semiconductor Corporation MOC215M, MOC216M, MOC217M Rev. 1.0 25°C unless otherwise specified) A Test Conditions ...

Page 4

... A Fig. 5 Dark Current vs. Ambient Temperature 10000 V = 10V CE 1000 100 – AMBIENT TEMPERATURE ( C) A ©2005 Fairchild Semiconductor Corporation MOC215M, MOC216M, MOC217M Rev. 1.0 0.1 100 0.01 0.1 Fig. 4 Output Current vs. Collector-Emitter Voltage 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 ...

Page 5

... R – BASE RESISTANCE ( TEST CIRCUIT INPUT R BE Figure 10. Switching Time Test Circuit and Waveforms ©2005 Fairchild Semiconductor Corporation MOC215M, MOC216M, MOC217M Rev. 1.0.1 (Continued) vs. R off BE 1.0 0.9 0.8 0.7 0 20mA F 0.5 0.4 0.3 0.2 0.1 ...

Page 6

... Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifi ...

Page 7

... Ordering Information Option Order Entry Identifi R2V Marking Information Definitions ©2005 Fairchild Semiconductor Corporation MOC215M, MOC216M, MOC217M Rev. 1.0.1 V VDE 0884 R2 Tape and reel (2500 units per reel) R2V VDE 0884, Tape and reel (2500 units per reel Fairchild logo ...

Page 8

... Carrier Tape Specifications 3.50 0.20 0.30 MAX 8.3 0.10 0.1 MAX User Direction of Feed Dimensions in mm ©2005 Fairchild Semiconductor Corporation MOC215M, MOC216M, MOC217M Rev. 1.0.1 8.0 0.10 2.0 0.05 4.0 0.10 6.40 0.20 8 Ø1.5 MIN 1.75 0.10 5.5 0.05 12.0 0.3 5 ...

Page 9

... Time (t ) Maintained Above (T L Peak Body Package Temperature Time (t ) within 5°C of 260°C P Ramp-down Rate (T Time 25°C to Peak Temperature ©2005 Fairchild Semiconductor Corporation MOC215M, MOC216M, MOC217M Rev. 1.0.1 Max. Ramp-up Rate = 3°C/S Max. Ramp-down Rate = 6°C/S Tsmax Preheat Area Tsmin t s 120 240 Time 25° ...

Page 10

... TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended exhaustive list of all such trademarks. Auto-SPM™ F-PFS™ Build it Now™ FRFET CorePLUS™ Global Power Resource CorePOWER™ ...

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