SB72-301CR NetBurner Inc, SB72-301CR Datasheet

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SB72-301CR

Manufacturer Part Number
SB72-301CR
Description
Ethernet Modules & Development Tools 32Bit 62MHz Single Board Module RJ45
Manufacturer
NetBurner Inc
Datasheet

Specifications of SB72-301CR

Lead Free Status / RoHS Status
Lead free / RoHS Compliant
S29AL008J
8 Megabit (1 M x 8-Bit/512 K x 16-Bit)
CMOS 3.0 Volt-only Boot Sector Flash Memory
Data Sheet
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume
such that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.
Publication Number S29AL008J_00
Revision 09
Issue Date February 23, 2010
S29AL008J Cover Sheet

Related parts for SB72-301CR

SB72-301CR Summary of contents

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S29AL008J 8 Megabit ( 8-Bit/512 K x 16-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory Data Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products ...

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Notice On Data Sheet Designations Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all ...

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S29AL008J 8 Megabit ( 8-Bit/512 K x 16-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory Data Sheet Distinctive Characteristics Architectural Advantages Single Power Supply Operation – Full voltage range: 2.7 to 3.6 volt read and write operations for ...

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General Description The S29AL008J Mbit, 3.0 Volt-only Flash memory organized as 1,048,576 bytes or 524,288 words. The device is offered in 48-ball Fine-pitch BGA (0.8 mm pitch), and 48-pin TSOP packages. The word-wide data (x16) appears on ...

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Table of Contents Distinctive Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

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Figures Figure 3.1 48-pin Standard TSOP (TS048 ...

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Tables Table 7.1 S29AL008J Device Bus Operations ...

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Product Selector Guide Family Part Number Speed Option Max access time ACC Max CE# access time Max CE# access time Note See AC Characteristics on page 42 2. Block Diagram RY/BY ...

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Connection Diagrams A15 A14 A13 A12 A11 A10 WE# RESET# NC WP# RY/BY# A18 A17 Figure 3.1 48-pin ...

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DQ4 DQ12 DQ5 DQ13 DQ6 DQ14 NC DQ7 NC DQ15/A-1 NC VSS BYTE# A16 A15 A14 A13 NC A12 NC A11 A10 WE# REST# 3.1 Special Handling Instructions Special handling is required for Flash Memory products ...

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Pin Configuration A0–A18 DQ0–DQ14 DQ15/A-1 BYTE# CE# OE# WE# WP# RESET# RY/BY Logic Symbol addresses 15 data inputs/outputs DQ15 (data input/output, word ...

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Ordering Information 6.1 S29AL008J Standard Products Spansion standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the elements below. S29AL008J 70 Valid Combinations Valid Combinations list configurations ...

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Device Bus Operations This section describes the requirements and use of the device bus operations, which are initiated through the internal command register. The command register itself does not occupy any addressable memory location. The register is composed of ...

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The device remains enabled for read access until the command register contents are altered. See Reading Array Data on page 28 timing specifications and to on page ...

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Automatic Sleep Mode The automatic sleep mode minimizes Flash device energy consumption. The device automatically enables this mode when addresses remain stable for t CE#, WE#, and OE# control signals. Standard address access timings provide new data when addresses ...

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Output Disable Mode When the OE# input impedance state. Sector A18 A17 SA0 0 0 SA1 0 0 SA2 0 0 SA3 0 0 SA4 0 1 SA5 0 1 SA6 0 1 SA7 0 1 ...

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Sector A18 A17 SA0 0 0 SA1 0 0 SA2 0 0 SA3 0 0 SA4 0 0 SA5 0 0 SA6 0 0 SA7 0 1 SA8 0 1 SA9 0 1 SA10 0 1 SA11 1 0 SA12 ...

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Autoselect Mode The autoselect mode provides manufacturer and device identification, and sector group protection verification, through identifier codes output on DQ7–DQ0. This mode is primarily intended for programming equipment to automatically match a device to be programmed with its ...

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Table 7.7 S29AL008J Top Boot Device Sector/Sector Group Protection Sector / Sector Block SA0-SA3 SA4-SA7 SA8-SA11 SA12-SA13 SA14 SA15 SA16 SA17 SA18 Table 7.8 S29AL008J Bottom Boot Device Sector/Sector Group Protection Sector / Sector Block SA0 SA1 SA2 SA3 SA4 ...

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Temporary Sector Group Unprotect This feature allows temporary unprotection of previously protected sector groups to change data in-system. The Sector Group Unprotect mode is activated by setting the RESET# pin to V protected sector groups can be programmed or ...

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Figure 7.2 In-System Sector Group Protect/Unprotect Algorithms START PLSCNT = 1 RESET Wait 1 µs No First Write Temporary Sector Group Cycle = 60h? Unprotect Mode Set up sector group address Sector Group Protect: Write 60h to sector ...

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Secured Silicon Sector Flash Memory Region The Secured Silicon Sector feature provides a 256-byte Flash memory region that enables permanent part identification through an Electronic Serial Number (ESN). The Secured Silicon Sector uses a Secured Silicon Sector Indicator Bit ...

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The Secured Silicon Sector protection must be used with caution since, once protected, there is no procedure available for unprotecting the Secured Silicon Sector area, and none of the bits in the Secured Silicon Sector memory space can be modified ...

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Common Flash Memory Interface (CFI) The Common Flash Interface (CFI) specification outlines device and host system software interrogation handshake, which allows specific vendor-specified software algorithms to be used for entire families of devices. Software support can then be device-independent, ...

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Addresses Addresses (Word Mode) (Byte Mode) 27h 28h 29h 2Ah 2Bh 2Ch 2Dh 2Eh 2Fh 30h 31h 32h 33h 34h 35h 36h 37h 38h 39h 3Ah 3Bh 3Ch Addresses Addresses (Word Mode) (Byte Mode) 40h 41h 42h 43h 44h 45h ...

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Addresses Addresses (Word Mode) (Byte Mode) 4Fh 50h 9.1 Hardware Data Protection The command sequence requirement of unlock cycles for programming or erasing provides data protection against inadvertent writes (refer to hardware data protection measures prevent accidental erasure or programming, ...

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Command Definitions Writing specific address and data commands or sequences into the command register initiates device operations. Table 10.1 on page 33 address and data values or writing them in the improper sequence resets the device to reading array ...

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Enter Secured Silicon Sector/Exit Secured Silicon Sector Command Sequence The Secured Silicon Sector region provides a secured data area containing a random, sixteen-byte electronic serial number (ESN). The system can access the Secured Silicon Sector region by issuing the ...

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Note See Table 10.1 on page 33 10.7 Chip Erase Command Sequence Chip erase is a six bus cycle operation. The chip erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock ...

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Sector Erase Command Sequence Sector erase is a six bus cycle operation. The sector erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the ...

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DQ6 status bits, just as in the standard program operation. See information. The system may also write the autoselect command sequence when the device is in the Erase Suspend mode. The device allows reading autoselect codes even at addresses within ...

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Command Definitions Table Command Sequence (Note 1) Read (Note 6) 1 Reset (Note 7) 1 Word Manufacturer ID 4 Byte Word Device ID, 4 Top Boot Block Byte Word Device ID, 4 Bottom Boot Block Byte Word Sector Group ...

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Write Operation Status The device provides several bits to determine the status of a write operation: DQ2, DQ3, DQ5, DQ6, DQ7, and RY/BY#. Table 11.1 on page 38 RY/BY#, and DQ6 each offer a method for determining whether a ...

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Notes Valid address for programming. During a sector erase operation, a valid address is an address within any sector selected for erasure. During chip erase, a valid address is any non-protected sector address. 2. DQ7 should be ...

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DQ6: Toggle Bit I Toggle Bit I on DQ6 indicates whether an Embedded Program or Erase algorithm is in progress or complete, or whether the device has entered the Erase Suspend mode. Toggle Bit I may be read at ...

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Reading Toggle Bits DQ6/DQ2 Refer to Figure 11.2 on page 37 toggle bit status, it must read DQ7–DQ0 at least twice in a row to determine whether a toggle bit is toggling. Typically, the system would note and store ...

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DQ5: Exceeded Timing Limits DQ5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. Under these conditions DQ5 produces a 1. This is a failure condition that indicates the program or erase cycle ...

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Absolute Maximum Ratings Parameter Storage Temperature Plastic Packages Ambient Temperature with Power Applied Voltage with Respect to Ground V (Note 1) CC A9, OE#, and RESET# All other pins (Note 1) Output Short Circuit Current Notes 1. Minimum DC ...

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DC Characteristics 14.1 CMOS Compatible Parameter Input Load Current I LI WP# Input Load Current I A9 Input Load Current LIT I Output Leakage Current LO V Active Read Current CC I CC1 (Note 1) V Active Erase/Program Current ...

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Test Conditions Note Diodes are IN3064 or equivalent. Output Load Output Load Capacitance, C (including jig capacitance) Input Rise and Fall Times Input Pulse Levels Input timing measurement reference levels Output timing measurement reference levels 16. Key to Switching ...

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AC Characteristics 17.1 Read Operations Parameter JEDEC Std t t AVAV AVQV ACC t t ELQV GLQV EHQZ GHQZ DF t SR/W t OEH t t AXQX ...

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Hardware Reset (RESET#) Parameter JEDEC Std RESET# Pin Low (During Embedded Algorithms READY Read or Write RESET# Pin Low (NOT During Embedded Algorithms READY Read or Write t RESET# Pulse Width RP t RESET# High ...

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Word/Byte Configuration (BYTE#) Parameter JEDEC Std t t CE# to BYTE# Switching Low or High ELFL/ ELFH t BYTE# Switching Low to Output HIGH Z FLQZ t BYTE# Switching High to Output Active FHQV CE# OE# BYTE# BYTE# DQ0–DQ14 ...

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Erase/Program Operations Parameter JEDEC Std t t AVAV AVWL WLAX DVWH WHDX DH t OES t t GHWL GHWL t t ELWL WHEH CH ...

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Addresses CE# OE# WE# Data RY/BY# t VCS V CC Notes sector address (for Sector Erase Valid Address for reading status data (see 2. Illustration shows device in word mode. Addresses CE# OE# WE# t ...

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Addresses CE OE# WE# DQ7 DQ0–DQ6 t BUSY RY/BY# Note VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array data read cycle. Addresses CE# t OE# WE# DQ6/DQ2 t ...

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Temporary Sector Group Unprotect Parameter JEDEC Std t VIDR t RSP t RRB Note Not 100% tested. 12V RESET CE# WE# RY/BY RESET# SA, A6, A3, A2 A1, A0 Data CE# WE# ...

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Alternate CE# Controlled Erase/Program Operations Parameter JEDEC Std t t AVAV AVEL ELAX DVEH EHDX DH t OES t t GHEL GHEL t t WLEL WS t ...

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Erase and Programming Performance Parameter Sector Erase Time Chip Erase Time Byte Programming Time Word Programming Time Chip Programming Time Notes 1. Typical program and erase times assume the following conditions: 25° Under worst case conditions of ...

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Physical Dimensions 20.1 TS 048—48-Pin Standard TSOP PACKAGE JEDEC SYMBOL MIN A --- A1 0.05 A2 0.95 b1 0.17 b 0.17 c1 0.10 c 0.10 D 19.80 D1 18.30 E 11. 0.50 Θ 0˚ R 0.08 N ...

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VBK048—48-Ball Fine-Pitch Ball Grid Array (BGA) 8. 6.15 mm INDEX MARK PIN A1 CORNER PACKAGE JEDEC 8. 6.15 mm NOM PACKAGE SYMBOL MIN A --- A1 0. ...

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SSOP56- 56-Pin Shrink Small Outline Package PACKAGE JEDEC MO-180 (A) BA SYMBOL MIN A --- A1 0.45 A2 1.15 b *0.25 b1 0.30 c 0.10 c1 0.10 D 23.40 E 15.70 E1 13.10 e 0.80 BASIC L 0.60 R ...

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Revision History Section Revision 01 (July 26, 2007) Initial release. Revision 02 (October 29, 2007) Distinctive Characteristics Corrected number of 64 Kbyte / 32 Kword sectors Removed 44-pin SOP package Global Removed all leaded package offerings Ordering Information Under ...

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Section Added 56-pin Shrink Small Outline Package (SSOP56) Physical Dimensions Alternate CE# Controlled Erase/Program TDS value changed from Operations Added figure Toggle Bit Timing (During Embedded Algorithm) Erase/Program Operation Updated Table Product Selector Guide Revision ...

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Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated ...

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