E-L6210 STMicroelectronics, E-L6210 Datasheet
E-L6210
Specifications of E-L6210
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E-L6210 Summary of contents
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... Table 1. Device summary Order code E-L6210 April 2008 Dual Schottky diode bridge PDIP 16 The L6210 is available pin powerdip package ( designed for the 0 to 70°C ambient temperature range ...
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... Contents Contents 1 Block and pin connection diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Mounting instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2/8 L6210 ...
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... L6210 1 Block and pin connection diagram Figure 1. Block diagram Figure 2. Pin connection (top view) Block and pin connection diagram 3/8 ...
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... External Heatsink 2.3 Electrical characteristics Table 4. Electrical characteristics (T = 25°C unless otherwise specified) J Symbol V Forward Voltage Drop F I Leakage Current L Note: At forward currents of greater than parasitic current of approximately 10 mA may be collected by adiacent diodes. 4/8 Parameter Parameter Parameter Test conditions I = 100 500 ...
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... During soldering the pin temperature must not exceed 260°C and the soldering time must not be longer then 12 s. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 3. Example of PC board copper area which is used as heatsink Figure 4 ...
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... Package information In order to meet environmental requirements, ST (also) offers these devices in ECOPACK packages. ECOPACK is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK trademark. ECOPACK specifications are available at: www.st.com. ...
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... L6210 5 Revision history Table 5. Document revision history Date 31-Jul-2003 23-Apr-2008 Revision 1 Initial release. 2 Package information updated. Revision history Changes 7/8 ...
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