LFE3-95E-PCIE-DKN Lattice, LFE3-95E-PCIE-DKN Datasheet - Page 119

• Manufacturer Part Number: LFE3-95E-PCIE-DKN
• Description: MCU, MPU & DSP Development Tools LatticeECP3 PCI Express Dev Kit
• Manufacturer: Lattice

Specifications of LFE3-95E-PCIE-DKN

• Processor To Be Evaluated: LFE3-95EA-x
• Processor Series: LatticeECP3
• Interface Type: SPI
• Operating Supply Voltage: 1.2 V to 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Lattice Semiconductor
Logic Signal Connections
Package pinout information can be found under “Data Sheets” on the LatticeECP3 product pages on the Lattice
website at
ate pinout information from within Design Planner, select View -> Package View. Then select Select File ->
Export and choose a type of output file. See Design Planner help for more information.
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Designers must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the Thermal Management document to find the device/package
specific thermal values.
For Further Information
For further information regarding Thermal Management, refer to the following:
•
• TN1181,
• Power Calculator tool included with the Lattice ispLEVER design tool, or as a standalone download from 
Thermal Management
www.latticesemi.com/software
www.latticesemi.com/products/fpga/ecp3
Power Consumption and Management for LatticeECP3 Devices
document
and in the Lattice ispLEVER Design Planner software. To cre-
4-10
LatticeECP3 Family Data Sheet
Pinout Information