LFE3-95E-PCIE-DKN Lattice, LFE3-95E-PCIE-DKN Datasheet - Page 44

MCU, MPU & DSP Development Tools LatticeECP3 PCI Express Dev Kit

LFE3-95E-PCIE-DKN

Manufacturer Part Number
LFE3-95E-PCIE-DKN
Description
MCU, MPU & DSP Development Tools LatticeECP3 PCI Express Dev Kit
Manufacturer
Lattice
Datasheet

Specifications of LFE3-95E-PCIE-DKN

Processor To Be Evaluated
LFE3-95EA-x
Processor Series
LatticeECP3
Interface Type
SPI
Operating Supply Voltage
1.2 V to 3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lattice Semiconductor
Figure 2-38. LatticeECP3 Banks
LatticeECP3 devices contain two types of sysI/O buffer pairs.
1. Top (Bank 0 and Bank 1) and Bottom sysI/O Buffer Pairs (Single-Ended Outputs Only)
The sysI/O buffer pairs in the top banks of the device consist of two single-ended output drivers and two sets of
single-ended input buffers (both ratioed and referenced). One of the referenced input buffers can also be con-
figured as a differential input. Only the top edge buffers have a programmable PCI clamp.
The two pads in the pair are described as “true” and “comp”, where the true pad is associated with the positive
side of the differential input buffer and the comp (complementary) pad is associated with the negative side of
the differential input buffer. 
On the top and bottom sides, there is no support for programmable on-chip input termination, which is required
for DQ and DQS pins for DDR3 interface. This side is ideal for ADDR/CMD signals of DDR3, general purpose 
I/O, PCI, TR-LVDS (transition reduced LVDS) or LVDS inputs. Only the top I/O banks support hot socketing
with I
DK
specified under the Hot Socketing Specifications. The configuration bank is not hot-socketable.
V REF1(7)
V REF2(7)
V
V REF1(6)
V REF2(6)
V CCIO6
CCIO7
GND
GND
Bank 0
BOTTOM
SERDES
TOP
Quads
2-41
Bank 1
LatticeECP3 Family Data Sheet
V REF1(2)
V REF2(2)
V CCIO2
GND
V REF1(3)
V REF2(3)
V CCIO3
GND
Architecture

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