PBRP113ET T/R NXP Semiconductors, PBRP113ET T/R Datasheet
PBRP113ET T/R
Specifications of PBRP113ET T/R
Related parts for PBRP113ET T/R
PBRP113ET T/R Summary of contents
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PBRP113ET PNP 800 mA BISS RET Rev. 01 — 17 December 2007 1. Product profile 1.1 General description 800 mA PNP low V Transistor (RET small SOT23 ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PBRP113ET 4. Marking Table 4. Type number PBRP113ET [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ...
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... NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol P tot amb T stg [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm [2] Device mounted on a ceramic PCB, Al [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm [3] Device mounted on a ceramic PCB th(j-a) 0.75 (K/W) 0.50 ...
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... NXP Semiconductors th(j- (K/W) 0.75 0. 0.33 0.20 0.10 0.05 10 0.02 0. FR4 PCB, mounting pad for collector 1 cm Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT23 (TO-236AB); typical values th(j-a) (K/ 0. 0.50 0.33 0.20 0.10 0.05 10 0.02 ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol I CBO I CEO I EBO CEsat V I(off) V I(on) R1 R2/ [1] Pulse test: t PBRP113ET_1 Product data sheet PNP 800 mA BISS RET Characteristics Parameter Conditions collector-base cut-off current collector-emitter cut-off current emitter-base cut-off current current gain ...
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... NXP Semiconductors ( 100 C amb ( amb ( amb Fig 5. DC current gain as a function of collector current; typical values 1 V CEsat (V) (1) ( 100 C amb ( amb ( amb Fig 7. Collector-emitter saturation voltage as a function of collector current; typical values PBRP113ET_1 Product data sheet PNP 800 mA BISS RET ...
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... NXP Semiconductors 10 V I(on) (V) (1) ( amb ( amb ( 100 C amb Fig 9. On-state input voltage as a function of collector current; typical values 8. Package outline Fig 11. Package outline SOT23 (TO-236AB) PBRP113ET_1 Product data sheet PNP 800 mA BISS RET 006aab077 10 V I(off) ( (mA (1) T amb (2) T amb ...
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... NXP Semiconductors 9. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PBRP113ET [1] For further information and the availability of packing methods, see 10. Soldering Fig 12. Reflow soldering footprint SOT23 (TO-236AB) 4.60 Fig 13. Wave soldering footprint SOT23 (TO-236AB) ...
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... NXP Semiconductors 11. Revision history Table 9. Revision history Document ID Release date PBRP113ET_1 20071217 PBRP113ET_1 Product data sheet PNP 800 mA BISS RET Data sheet status Change notice Product data sheet - Rev. 01 — 17 December 2007 PBRP113ET Supersedes - © NXP B.V. 2007. All rights reserved. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 14. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 12 Legal information ...