PBRP113ZT T/R NXP Semiconductors, PBRP113ZT T/R Datasheet
PBRP113ZT T/R
Specifications of PBRP113ZT T/R
Related parts for PBRP113ZT T/R
PBRP113ZT T/R Summary of contents
Page 1
PBRP113ZT PNP 800 mA BISS RET Rev. 01 — 16 January 2008 1. Product profile 1.1 General description 800 mA PNP low V Transistor (RET small SOT23 ...
Page 2
... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PBRP113ZT 4. Marking Table 4. Type number PBRP113ZT [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ...
Page 3
... NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol P tot amb T stg [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm [2] Device mounted on a ceramic PCB, Al [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
Page 4
... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm [3] Device mounted on a ceramic PCB th(j-a) 0.75 (K/W) 0.50 ...
Page 5
... NXP Semiconductors th(j- (K/W) 0.75 0. 0.33 0.20 0.10 0.05 10 0.02 0. FR4 PCB, mounting pad for collector 1 cm Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT23 (TO-236AB); typical values th(j-a) (K/ 0. 0.50 0.33 0.20 0.10 0.05 10 0.02 ...
Page 6
... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol I CBO I CEO I EBO CEsat V I(off) V I(on) R1 R2/ [1] Pulse test: t PBRP113ZT_1 Product data sheet PNP 800 mA BISS RET Characteristics Parameter Conditions collector-base cut-off current collector-emitter cut-off current emitter-base cut-off current current gain ...
Page 7
... NXP Semiconductors 3 10 ( 100 C amb ( amb ( amb Fig 5. DC current gain as a function of collector current; typical values 1 V CEsat ( (1) ( 100 C amb ( amb ( amb Fig 7. Collector-emitter saturation voltage as a function of collector current; typical values PBRP113ZT_1 Product data sheet PNP 800 mA BISS RET ...
Page 8
... NXP Semiconductors 10 V I(on) (V) 1 (1) ( amb ( amb ( 100 C amb Fig 9. On-state input voltage as a function of collector current; typical values 8. Package outline Fig 11. Package outline SOT23 (TO-236AB) PBRP113ZT_1 Product data sheet PNP 800 mA BISS RET 006aab083 10 V I(off) ( (mA (1) T amb (2) T amb ...
Page 9
... NXP Semiconductors 9. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PBRP113ZT [1] For further information and the availability of packing methods, see 10. Soldering Fig 12. Reflow soldering footprint SOT23 (TO-236AB) 4.60 Fig 13. Wave soldering footprint SOT23 (TO-236AB) ...
Page 10
... NXP Semiconductors 11. Revision history Table 9. Revision history Document ID Release date PBRP113ZT_1 20080116 PBRP113ZT_1 Product data sheet PNP 800 mA BISS RET Data sheet status Change notice Product data sheet - Rev. 01 — 16 January 2008 PBRP113ZT Supersedes - © NXP B.V. 2008. All rights reserved. ...
Page 11
... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
Page 12
... NXP Semiconductors 14. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 12 Legal information ...