MLG1005SR10JT TDK Corporation, MLG1005SR10JT Datasheet
MLG1005SR10JT
Manufacturer Part Number
MLG1005SR10JT
Description
INDUCTOR
Manufacturer
TDK Corporation
Series
MLG1005r
Specifications of MLG1005SR10JT
Rohs Compliant
YES
Inductance
100 nH
Tolerance
5 %
Maximum Dc Current
200 mAmps
Maximum Dc Resistance
2 Ohms
Self Resonant Frequency
0.9 GHz
Q Minimum
8
Operating Temperature Range
- 55 C to + 125 C
Termination Style
SMD/SMT
Package / Case
0402 (1005 metric)
Dimensions
0.5 mm W x 1 mm L x 0.5 mm H
Test Frequency
100 MHz
Lead Free Status / Rohs Status
Details
SMD Inductors(Coils)
For High Frequency(Multilayer)
MLG Series MLG1005S Type
FEATURES
• Nominal inductance values are supported from 0.3 to 390nH.
• Provides high Q characteristics.
• Advanced monolithic structure is formed using a multilayering
• The products contain no lead and also support lead-free
• It is a product conforming to RoHS directive.
APPLICATIONS
For high-frequency applications including mobile phones, high
frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB
and tuners.
SHAPES AND DIMENSIONS
RECOMMENDED PC BOARD PATTERN
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• Please contact our Sales office when your application are considered the following:
• All specifications are subject to change without notice.
250 to 260˚C
230˚C
180˚C
150˚C
0.4 to 0.5 0.4 to 0.5 0.4 to 0.5
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
and sintering process with ceramic and conductive materials for
high-frequency.
soldering.
Preheating
60 to 120s
1.0±0.05
0.25±0.1
Time(s)
Soldering
10s max.
30 to 60s
Dimensions in mm
Natural
cooling
Weight: 1mg
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions
(3) Material code
(4) Inductance value
(5) Inductance tolerance
(6) Packaging style
SPECIFICATIONS
Operating temperature range
Storage temperature range
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
• After mounting components onto the printed circuit board, do not
• When hand soldering, apply the soldering iron to the printed
MLG 1005 S 2N2 S
(1)
The preheating temperature should be set so that the
temperature difference between the solder temperature and
product temperature does not exceed 150°C.
apply stress through board bending or mishandling.
circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
1005
2N2
12N
R10
B
C
S
H
J
T
(2)
(3) (4) (5) (6)
T
–55 to +125°C
–55 to +125°C [Unit of products]
006-01 / 20070703 / e521_mlg1005.fm
2.2nH
12nH
100nH
±0.1nH
±0.2nH
±0.3nH
±3%
±5%
Taping (reel)
1.0× 0.5mm (L× W)
Quantity
10000 pieces/reel
Conformity to RoHS Directive
(1/6)
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