MWI300-12E9 IXYS, MWI300-12E9 Datasheet

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MWI300-12E9

Manufacturer Part Number
MWI300-12E9
Description
Discrete Semiconductor Modules 300 Amps 1200V
Manufacturer
IXYS
Type
Six-Pack IGBT Modulesr
Datasheet

Specifications of MWI300-12E9

Product
Power Semiconductor Modules
Mounting Style
Screw
Package / Case
E+
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MWI300-12E9
Manufacturer:
IXYS
Quantity:
1 000
Part Number:
MWI300-12E9
Quantity:
60
IGBT Modules
Sixpack
IXYS reserves the right to change limits, test conditions and dimensions.
© 2007 IXYS All rights reserved
IGBTs
Symbol
V
V
I
I
RBSOA
t
(SCSOA)
P
Symbol
V
V
I
I
t
t
t
t
E
E
C
Q
R
CES
GES
C25
C80
SC
d(on)
r
d(off)
f
GE(th)
GES
CE(sat)
on
off
CES
tot
ies
thJC
Gon
Conditions
T
T
T
R
Clamped inductive load; L = 00 µH
V
T
T
Conditions
I
I
V
V
Inductive load, T
V
V
V
V
C
C
VJ
C
C
VJ
C
CE
CE
CE
GE
CE
CE
CE
G
= 300 A; V
= 2 mA; V
= 25°C
= 80°C
= 25°C
= 3.3 Ω; T
= 25°C to 25°C
= 25°C; non-repetitive; V
= V
= 600 V; V
= 900 V; V
= 0 V; V
= 600 V; I
= ± 5 V; R
= 25 V; V
CES
; V
GE
GE
GE
GE
VJ
GE
C
GE
GE
= ± 20 V
G
= 0 V
= 300 A
= 5 V
= 25°C
= 0 V; f =  MHz
= V
= 3.3 Ω
= ± 5 V; R
VJ
= 5 V; I
= 25°C
CE
C
= 300 A
G
T
T
T
T
29
28
VJ
VJ
VJ
VJ
= 3.3 Ω
CEmax
(T
= 25°C
= 25°C
= 25°C
= 25°C
VJ
5
6
7
3
4
< V
= 25°C, unless otherwise specified)
CES
2

/2
min.
4.5
20
2
22
8
9
Characteristic Values
Maximum Ratings
typ.
80
00
650
20
2.0
2.2
0.4
2.3
V
9
32
22
I
CEK
3

4
CM
9/0
= 750
< V
200
max.
0.06
± 20
25
26
27
23
24
530
375
600
2.
2.4
2.7
6.5
CES
2
0

K/W
5
6
mA
mA
kW
mJ
mJ
µC
nA
nF
7/8
µs
ns
ns
ns
ns
V
V
A
A
A
V
V
V
I
V
V
See outline drawing for pin arrangement
Features
• NPT
• low saturation voltage
• low switching losses
• square RBSOA, no latch up
• high short circuit capability
• positive temperature coefficient for
• MOS input, voltage controlled
• ultra fast free wheeling diodes
• solderable pins for PCB mounting
• package with copper base plate
Advantages
• space savings
• reduced protection circuits
• package designed for wave soldering
Typical Applications
• AC motor control
• AC servo and robot drives
• power supplies
C80
easy parallelling
CES
CE(sat) typ.
3
IGBT technology
MWI 300-12 E9
= 375 A
= 1200 V
=
2.0 V
E72873
 - 5

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MWI300-12E9 Summary of contents

Page 1

... VJ d(off 600 300 ± 3.3 Ω off MHz ies 600 Gon thJC IXYS reserves the right to change limits, test conditions and dimensions. © 2007 IXYS All rights reserved /2 9/ Maximum Ratings 200 ± 20 530 375 I = 750 CM V < V CEK = 3.3 Ω ...

Page 2

... Weight * ) ·I resp CEsat therm-chip C F IXYS reserves the right to change limits, test conditions and dimensions. © 2007 IXYS All rights reserved Maximum Ratings 300 600 = 0 V 2400 R Characteristic Values (T = 25°C, unless otherwise specified) VJ min. typ. ...

Page 3

... Dimensions 0.0394" 2.884·0 .523·0 7.67·0 0.03 0.036 IXYS reserves the right to change limits, test conditions and dimensions. © 2007 IXYS All rights reserved = tolerance for all dimensions: Diode IGBT τ ·0 2.344· 5·0 5.97· 0.02 5.97·0 ...

Page 4

... I = 100 -10 -15 - [µ Fig. 5 Typ. turn on gate charge IXYS reserves the right to change limits, test conditions and dimensions. © 2007 IXYS All rights reserved 600 500 400 300 200 100 0 2.5 3.0 Fig. 2 Typ. transfer characteristics 600 500 400 300 9 V 200 ...

Page 5

... Fig. 0 Typ. turn off energy and switching times versus gate resistor single pulse 1 10 100 1000 [ms] t Fig. 2 Typ. transient thermal impedance 800 600 t d(off) 400 200 600 4500 4000 3500 3000 2500 2000 1500 1000 500 0 40 diode IGBT MWI300-12E9 10000 ...

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