BZX84J-C5V1,115 NXP Semiconductors, BZX84J-C5V1,115 Datasheet - Page 9

• Manufacturer Part Number: BZX84J-C5V1,115
• Description: DIODE ZENER 5.1V 550MW SC-90
• Manufacturer: NXP Semiconductors

Specifications of BZX84J-C5V1,115

• Package / Case: SC-90, SOD-323F
• Voltage - Zener (nom) (vz): 5.1V
• Voltage - Forward (vf) (max) @ If: 900mV @ 10mA
• Current - Reverse Leakage @ Vr: 2µA @ 2V
• Tolerance: ±5%
• Power - Max: 550mW
• Impedance (max) (zzt): 60 Ohm
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 150°C
• Zener Voltage: 5.1 V
• Voltage Tolerance: 5 %
• Voltage Temperature Coefficient: - 0.75 mV / K
• Power Dissipation: 550 mW
• Maximum Reverse Leakage Current: 2 uA
• Maximum Zener Impedance: 60 Ohms
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 65 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934061012115; BZX84J-C5V1 T/R; BZX84J-C5V1 T/R

NXP Semiconductors
8. Package outline
9. Packing information
10. Soldering
BZX84J_SER_1
Product data sheet
Table 10.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
BZX84J-B2V4 to
BZX84J-C75
Fig 7. Package outline SOD323F (SC-90)
Fig 8. Reflow soldering footprint SOD323F (SC-90)
For further information and the availability of packing methods, see
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.65
Packing methods
0.95
Package
SOD323F
Dimensions in mm
0.50
(2 )
Rev. 01 — 1 March 2007
2.7
2.3
Description
4 mm pitch, 8 mm tape and reel
1.8
1.6
3.05
2.80
2.10
1.60
1.35
1.15
1
2
0.40
0.25
0.50
msa433
0.60
0.5
0.3
Section
0.80
0.65
BZX84J series
0.25
0.10
[1]
04-09-13
13.
Single Zener diodes
solder lands
solder resist
occupied area
solder paste
Packing quantity
3000
-115
© NXP B.V. 2007. All rights reserved.
10000
-135
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