ISP1520BD ST-Ericsson Inc, ISP1520BD Datasheet - Page 49

• Manufacturer Part Number: ISP1520BD
• Description: IC, CONTROLLER, USB HUB, 64-LQFP
• Manufacturer: ST-Ericsson Inc

Specifications of ISP1520BD

• Usb Type: USB Peripheral Controller
• Usb Version: 2.0
• Data Rate: 480Mbps
• No. Of Ports: 5
• Supply Voltage Range: 3V To 3.6V, 4.5V To 5.5V
• Digital Ic Case Style: QFP
• No. Of Pins: 64
• Package / Case: LQFP
• Applications: USB Hub/Microcontroller
• Interface: I²C
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-1168; ISP1520BD,557

Philips Semiconductors
20. Abbreviations
21. References
ISP1520_4
Product data sheet
[4]
[5]
[6]
[7]
[8]
[9]
Table 48.
[1]
[2]
[3]
Acronym
ACPI
CRC
EEPROM
EMI
EOP
ESD
FET
HS
LSB
MSB
MOSFET
NAK
PCB
PID
PLL
SIE
SOP
TT
TTL
USB
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Universal Serial Bus Specification Rev. 2.0
The I
ISP1520 Hub Demo Board User’s Guide
Abbreviations
2
C-bus specification
Description
Advanced Configuration and Power Interface
Cyclical Redundancy Check
Electronically Erasable Programmable Read-Only Memory
ElectroMagnetic Interference
End-of-Packet
ElectroStatic Discharge
Field-Effect Transistor
High-Speed
Least Significant Bit
Most Significant Bit
Metal Oxide Silicon Field Effect Transistor
Not AcKnowledge
Printed-Circuit Board
Packet IDentifier
Phase-Locked Loop
Serial Interface Engine
Start-of-Packet
Transaction Translator
Transistor-Transistor Logic
Universal Serial Bus
Rev. 04 — 28 April 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Hi-Speed USB hub controller
ISP1520
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