UPD43256BGU-85L NEC, UPD43256BGU-85L Datasheet - Page 21

• Manufacturer Part Number: UPD43256BGU-85L
• Description: IC'S
• Manufacturer: NEC

Recommended Soldering Conditions
to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E).
under different conditions.
Types of Surface Mount Device
Type of Through Hole Mount Device
PD43256BGU: 28-pin plastic SOP (450 mil)
PD43256BGW-9JL: 28-pin plastic TSOP (I) (8
PD43256BGW-9KL: 28-pin plastic TSOP (I) (8
PD43256BCZ: 28-pin plastic DIP (600 mil)
Wave soldering
(only to leads)
Partial heating method
The following conditions (See table below) must be met when soldering PD43256B. For more details, refer
Please consult with our sales offices in case other soldering process is used, or in case soldering is done
Please consult with our sales offices.
Caution Do not jet molten solder on the surface of package.
Soldering process
Solder temperature: 260 ˚C or below,
Flow time: 10 seconds or below
Terminal temperature: 300 ˚C or below,
Time: 3 seconds or below (Per one lead)
Soldering conditions
13.4 mm) (Normal bent)
13.4 mm) (Reverse bent)
PD43256B
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