AD5333BRUZ-REEL Analog Devices Inc, AD5333BRUZ-REEL Datasheet - Page 4

• Manufacturer Part Number: AD5333BRUZ-REEL
• Description: IC,D/A CONVERTER,DUAL,10-BIT,CMOS,TSSOP,24PIN
• Manufacturer: Analog Devices Inc

Specifications of AD5333BRUZ-REEL

• Settling Time: 7µs
• Number Of Bits: 10
• Data Interface: Parallel
• Number Of Converters: 2
• Voltage Supply Source: Single Supply
• Power Dissipation (max): 2.25mW
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD5332/AD5333/AD5342/AD5343
Model
AD5332BRU
AD5333BRU
AD5342BRU
AD5343BRU
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD5332/AD5333/AD5342/AD5343 features proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS*
(T
V
Digital Input Voltage to GND . . . . . . . –0.3 V to V
Digital Output Voltage to GND . . . . . –0.3 V to V
Reference Input Voltage to GND . . . . –0.3 V to V
V
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
TSSOP Package
DD
OUT
A
Power Dissipation . . . . . . . . . . . . . . . (T
Industrial (B Version) . . . . . . . . . . . . . . . –40°C to +105°C
θ
= 25°C unless otherwise noted)
JA
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
to GND . . . . . . . . . . . . . . . . . . . –0.3 V to V
Thermal Impedance (20-Lead TSSOP) . . . . . 143°C/W
Temperature Range
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
J
max – T
DD
DD
DD
DD
A
)/θ
ORDERING GUIDE
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
JA
Package Description
TSSOP (Thin Shrink Small Outline Package)
TSSOP (Thin Shrink Small Outline Package)
TSSOP (Thin Shrink Small Outline Package)
TSSOP (Thin Shrink Small Outline Package)
mW
–4–
Reflow Soldering
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
θ
Peak Temperature . . . . . . . . . . . . . . . . . . . . . 220 +5/–0°C
Time at Peak Temperature . . . . . . . . . . . . 10 sec to 40 sec
θ
θ
θ
θ
JA
JA
JC
JC
JC
Thermal Impedance (24-Lead TSSOP) . . . . . 128°C/W
Thermal Impedance (28-Lead TSSOP) . . . . 97.9°C/W
Thermal Impedance (20-Lead TSSOP) . . . . . . 45°C/W
Thermal Impedance (24-Lead TSSOP) . . . . . . 42°C/W
Thermal Impedance (28-Lead TSSOP) . . . . . . 14°C/W
WARNING!
ESD SENSITIVE DEVICE
Package
Option
RU-20
RU-24
RU-28
RU-20
REV. 0