AD9520-3BCPZ Analog Devices Inc, AD9520-3BCPZ Datasheet - Page 17

• Manufacturer Part Number: AD9520-3BCPZ
• Description: 12/24 Channel Clock Gen 2,0GH
• Manufacturer: Analog Devices Inc
• Type: Clock Generator, Fanout Distributionr

Specifications of AD9520-3BCPZ

• Design Resources: Synchronizing Multiple AD9910 1 GSPS Direct Digital Synthesizers (CN0121) Phase Coherent FSK Modulator (CN0186)
• Pll: Yes
• Input: CMOS, LVDS, LVPECL
• Output: CMOS, LVPECL
• Number Of Circuits: 1
• Ratio - Input:output: 2:12, 2:24
• Differential - Input:output: Yes/Yes
• Frequency - Max: 2.25GHz
• Divider/multiplier: Yes/No
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-LFCSP
• Frequency-max: 2.25GHz
• Function: Clock Generator
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Package Type: LFCSP EP
• Pin Count: 64
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 19.
Parameter or Pin
VS
VCP, CP
VS_DRV
REFIN, REFIN
RSET, LF, BYPASS
CPRSET
CLK, CLK
CLK
SCLK/SCL, SDIO/SDA, SDO, CS
OUT0, OUT0, OUT1, OUT1,
OUT2, OUT2, OUT3, OUT3,
OUT4, OUT4, OUT5, OUT5,
OUT6, OUT6, OUT7, OUT7,
OUT8, OUT8, OUT9, OUT9,
OUT10, OUT10, OUT11, OUT11
SYNC , RESET , PD
REFMON, STATUS, LD
SP0, SP1, EEPROM
Junction Temperature
Storage Temperature Range
Lead Temperature (10 sec)
1
See Table 20 for θ
JA
.
1
With
Respect to
GND
GND
GND
GND
GND
GND
GND
CLK
GND
GND
GND
GND
GND
Rating
−0.3 V to +3.6 V
−0.3 V to +5.8 V
−0.3 V to +3.6 V
−0.3 V to VS + 0.3 V
−0.3 V to VS + 0.3 V
−0.3 V to VS + 0.3 V
−0.3 V to VS + 0.3 V
−1.2 V to +1.2 V
−0.3 V to VS + 0.3 V
−0.3 V to VS + 0.3 V
−0.3 V to VS + 0.3 V
−0.3 V to VS + 0.3 V
−0.3 V to VS + 0.3 V
150°C
−65°C to +150°C
300°C
Rev. 0 | Page 17 of 84
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Thermal impedance measurements were taken on a JEDEC 51-5
2S2P test board in still air in accordance with JEDEC JESD 51-2.
See the Thermal Performance section for more details.
Table 20.
Package Type
64-Lead LFCSP (CP-64-4)
ESD CAUTION
θ
22
JA
AD9520-3
Unit
°C/W