AD9832BRU Analog Devices Inc, AD9832BRU Datasheet - Page 23

• Manufacturer Part Number: AD9832BRU
• Description: D/A Converter (D-A) IC
• Manufacturer: Analog Devices Inc

Specifications of AD9832BRU

• No. Of Pins: 16
• Peak Reflow Compatible (260 C): No
• No. Of Bits: 10 Bit
• Leaded Process Compatible: No
• Mounting Type: Surface Mount
• Interface Type: Serial
• Package / Case: 16-TSSOP
• Rohs Status: RoHS non-compliant
• Resolution (bits): 10 b
• Master Fclk: 25MHz
• Tuning Word Width (bits): 32 b
• Voltage - Supply: 2.97 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• For Use With: EVAL-AD9832EBZ - BOARD EVAL FOR AD9832
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD9832BRU
AD9832BRU-REEL
AD9832BRU-REEL7
AD9832BRUZ
AD9832BRUZ-REEL
AD9832BRUZ-REEL7
EVAL-AD9832EBZ
1
Z = RoHS Compliant Part.
1
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Temperature Range
0.15
0.05
4.50
4.40
4.30
PIN 1
Figure 34. 16-Lead Thin Shrink Small Outline Package (TSSOP)
BSC
0.65
16
1
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AB
5.10
5.00
4.90
0.10
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
Evaluation Board
Dimensions shown in millimeters
0.30
0.19
9
8
Rev. B | Page 23 of 24
1.20
MAX
SEATING
PLANE
6.40
BSC
(RU-16)
0.20
0.09
8°
0°
0.75
0.60
0.45
Package Option
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
AD9832