ADF4360-9BCPZ Analog Devices Inc, ADF4360-9BCPZ Datasheet - Page 22

• Manufacturer Part Number: ADF4360-9BCPZ
• Description: Synthesizer And VCO
• Manufacturer: Analog Devices Inc
• Type: Fanout Distribution, Integer N Synthesizer (RF)r

Specifications of ADF4360-9BCPZ

• Pll: Yes
• Input: CMOS
• Output: Clock
• Number Of Circuits: 1
• Ratio - Input:output: 1:2
• Differential - Input:output: No/No
• Frequency - Max: 400MHz
• Divider/multiplier: Yes/No
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-LFCSP
• Frequency-max: 400MHz
• Number Of Elements: 1
• Supply Current: 5mA
• Pll Input Freq (min): 10MHz
• Pll Input Freq (max): 250MHz
• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Package Type: LFCSP EP
• Output Frequency Range: 1.1 to 400MHz
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature Classification: Industrial
• Pin Count: 24
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADF4360-9
INTERFACING
The ADF4360 family has a simple SPI-compatible serial interface
for writing to the device. CLK, DATA, and LE control the data
transfer. When LE goes high, the 24 bits that are clocked into
the appropriate register on each rising edge of CLK are transferred
to the appropriate latch. See Figure 2 for the timing diagram
and Table 5 for the latch truth table.
The maximum allowable serial clock rate is 20 MHz. This
means that the maximum update rate possible is 833 kHz, or
one update every 1.2 μs. This is more than adequate for systems
that have typical lock times in hundreds of microseconds.
ADuC812 Interface
Figure 31 shows the interface between the ADF4360 family and
the
on an 8051 core, this interface can be used with any 8051-based
microcontrollers. The MicroConverter is set up for SPI master
mode with CPHA = 0. To initiate the operation, the I/O port
driving LE is brought low. Each latch of the ADF4360 family
needs a 24-bit word, which is accomplished by writing three
8-bit bytes from the MicroConverter to the device. After the
third byte is written, the LE input should be brought high to
complete the transfer.
I/O port lines on the ADuC812 are used to detect lock (MUXOUT
configured as lock detect and polled by the port input). When
operating in the described mode, the maximum SCLOCK rate
of the ADuC812 is 4 MHz. This means that the maximum rate
at which the output frequency can be changed is 166 kHz.
ADuC812
ADuC812
I/O PORTS
SCLOCK
Figure 31. ADuC812 to ADF4360-x Interface
MicroConverter®. Because the ADuC812 is based
MOSI
SDATA
SCLK
LE
CE
MUXOUT
(LOCK DETECT)
ADF4360-x
Rev. A | Page 22 of 24
ADSP-21xx Interface
Figure 32 shows the interface between the ADF4360 family and
the ADSP-21xx digital signal processor. The ADF4360 family
needs a 24-bit serial word for each latch write. The easiest way
to accomplish this using the ADSP-21xx family is to use the
autobuffered transmit mode of operation with alternate framing.
This provides a means for transmitting an entire block of serial
data before an interrupt is generated.
Set up the word length for 8 bits and use three memory
locations for each 24-bit word. To program each 24-bit latch,
store the 8-bit bytes, enable the autobuffered mode, and write to
the transmit register of the DSP. This last operation initiates the
autobuffer transfer.
PCB DESIGN GUIDELINES FOR CHIP SCALE
PACKAGE
The leads on the chip scale package (CP-24-2) are rectangular.
The PCB pad for these should be 0.1 mm longer than the
package lead length and 0.05 mm wider than the package lead
width. The lead should be centered on the pad to ensure that
the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the PCB should be at least as large as this
exposed pad. On the PCB, there should be a clearance of at least
0.25 mm between the thermal pad and the inner edges of the
pad pattern to ensure that shorting is avoided.
Thermal vias can be used on the PCB thermal pad to improve
thermal performance of the package. If vias are used, they should
be incorporated into the thermal pad at 1.2 mm pitch grid. The
via diameter should be between 0.3 mm and 0.33 mm, and the
via barrel should be plated with 1 ounce of copper to plug the via.
The user should connect the printed circuit thermal pad to AGND.
This is internally connected to AGND.
ADSP-21xx
I/O PORTS
Figure 32. ADSP-21xx to ADF4360-x Interface
SCLOCK
MOSI
TFS
SDATA
SCLK
LE
CE
MUXOUT
(LOCK DETECT)
ADF4360-x