ADSP-21065LCSZ-240 Analog Devices Inc, ADSP-21065LCSZ-240 Datasheet - Page 38

ADSP-21065L 60 Mhz

ADSP-21065LCSZ-240

Manufacturer Part Number
ADSP-21065LCSZ-240
Description
ADSP-21065L 60 Mhz
Manufacturer
Analog Devices Inc
Series
SHARC®r
Type
Fixed/Floating Pointr
Datasheet

Specifications of ADSP-21065LCSZ-240

Interface
Host Interface, Serial Port
Clock Rate
60MHz
Non-volatile Memory
External
On-chip Ram
64kB
Voltage - I/o
3.30V
Voltage - Core
3.30V
Operating Temperature
-40°C ~ 100°C
Mounting Type
Surface Mount
Package / Case
208-MQFP, 208-PQFP
Device Core Size
32b
Architecture
Enhanced Harvard
Format
Floating Point
Clock Freq (max)
60MHz
Mips
60
Device Input Clock Speed
60MHz
Ram Size
68KB
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3.13V
Operating Supply Voltage (max)
3.6V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
208
Package Type
MQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
ADS-P21065LCSZ240
ADS-P21065LCSZ240

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADSP-21065LCSZ-240
Manufacturer:
AD
Quantity:
310
Part Number:
ADSP-21065LCSZ-240
Manufacturer:
Analog Devices Inc
Quantity:
10 000
ADSP-21065L
POWER DISSIPATION
Total power dissipation has two components: one due to inter-
nal circuitry and one due to the switching of external output
drivers. Internal power dissipation depends on the sequence in
which instructions execute and the data operands involved. See
I
power dissipation is calculated this way:
The external component of total power dissipation is caused by
the switching of output pins. Its magnitude depends on:
– the number of output pins that switch during each cycle (O)
– the maximum frequency at which the pins can switch (f)
– the load capacitance of the pins (C)
– the voltage swing of the pins (V
The external component is calculated using:
The load capacitance should include the processor’s package
capacitance (C
high and then back low. Address and data pins can drive high
and low at a maximum rate of 1/t
mode.
Example:
Estimate P
– a system with one bank of external memory (32-bit)
– two 1M ¥ 16 SDRAM chips, each with a control signal load
– external data writes occur in burst mode, two every 1/t
– the external SDRAM clock rate is 60 MHz (2/t
The P
drive:
Pin
Type
Address
MS
SDWE
Data
SDRAM CLK 1
DDIN
of 3 pF and a data signal load of 4 pF
cycles, a potential frequency of 1/t
pin switching
0
calculation in Electrical Characteristics section. Internal
EXT
equation is calculated for each class of pins that can
EXT
Table V. External Power Calculations
# of
Pins Switching
11
1
1
32
IN
with the following assumptions:
). The frequency f includes driving the load
%
50
0
0
50
P
EXT
P
INT
= O ¥ C ¥ V
= I
¥ 10.7
¥ 10.7
¥ 10.7
¥ 7.7
¥ 10.7
DDIN
C
CK
DD
¥ V
).
while in SDRAM burst
CK
¥ 30 MHz ¥ 10.9 V = 0.019 W
¥ 30 MHz ¥ 10.9 V = 0.042 W
¥ 30 MHz ¥ 10.9 V = 0.007 W
DD
f
DD
cycles/s. Assume 50%
2
¥ f
¥ 10.9 V = 0.000 W
¥ 10.9 V = 0.000 W
V
CK
DD
P
).
2
EXT
= 0.068 W
= P
CK
EXT
–38–
A typical power consumption can now be calculated for these
conditions by adding a typical internal power dissipation. (I
see calculation in Electrical Characteristics section):
Note that the conditions causing a worst-case P
those causing a worst-case P
while 100% of the output pins are switching from all ones (1s)
to all zeros (0s). Note also that it is not common for an appli-
cation to have 100% or even 50% of the outputs switching
simultaneously.
ENVIRONMENTAL CONDITIONS
Thermal Characteristics
The ADSP-21065L is offered in a 208-lead MQFP and a 196-
ball Mini-BGA package.
The ADSP-21065L is specified for a case temperature (T
To ensure that T
used.
T
PD =
q
q
Airflow
(Linear Ft./Min.)
q
(Linear Ft./Min.)
q
JC
JC
CA
CA
CASE
=
=
(∞C/W)
(∞C/W)
Table VI. Thermal Characteristics (208-Lead MQFP)
= Case temperature (measured on top surface of package)
Power Dissipation in W (this value depends upon the
specific application; a method for calculating PD is
shown under Power Dissipation)
7.1∞C/W for 208-lead MQFP
5.1∞C/W for 196-ball Mini-BGA
Table VII. 196-Ball Mini-BGA
P
CASE
TOTAL
T
CASE
is not exceeded, an air flow source may be
= P
0
24
0
38
= T
EXT
INT
AMB
. Maximum P
+ (I
+ (PD ¥ q
100
20
DDIN
¥ V
CA
200
19
200
29
DD
)
INT
)
EXT
cannot occur
differ from
400
17
REV. C
CASE
DDIN
600
13
400
23
)
.

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