ADSP-21065LCSZ-240 Analog Devices Inc, ADSP-21065LCSZ-240 Datasheet - Page 44

• Manufacturer Part Number: ADSP-21065LCSZ-240
• Description: ADSP-21065L 60 Mhz
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Fixed/Floating Pointr

Specifications of ADSP-21065LCSZ-240

• Interface: Host Interface, Serial Port
• Clock Rate: 60MHz
• Non-volatile Memory: External
• On-chip Ram: 64kB
• Voltage - I/o: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: 208-MQFP, 208-PQFP
• Device Core Size: 32b
• Architecture: Enhanced Harvard
• Format: Floating Point
• Clock Freq (max): 60MHz
• Mips: 60
• Device Input Clock Speed: 60MHz
• Ram Size: 68KB
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 3.13V
• Operating Supply Voltage (max): 3.6V
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 208
• Package Type: MQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ADS-P21065LCSZ240; ADS-P21065LCSZ240

ADSP-21065L
Revision History
Location
6/03—Data Sheet changed from REV. B to REV. C.
Edit to GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Removal of overbar from DQM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Universal
Edit to POWER DISSIPATION ADSP-21065L (equations above Table III) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Addition to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Update to OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41, 44
Part
Number
ADSP-21065LKS-240
ADSP-21065LCS-240
ADSP-21065LKCA-240
ADSP-21065LKS-264
ADSP-21065LKCA-264
ADSP-21065LCCA-240
NOTES:
1. THE ACTUAL POSITION OF THE BALL GRID IS WITHIN 0.30 OF ITS IDEAL POSITION RELATIVE TO THE
2. THE ACTUAL POSITION OF EACH BALL IS WITHIN 0.10 OF ITS IDEAL POSITION
3. DIMENSIONS COMPLY WITH JEDEC STANDARD MS-034AAE-1.
4. CENTER DIMENSIONS ARE NOMINAL.
1.90
1.75
1.55
PACKAGE EDGES.
RELATIVE TO THE BALL GRID.
Range
–40°C to +100°C
–40°C to +100°C
Case Temperature
0°C to +85°C
0°C to +85°C
0°C to +85°C
0°C to +85°C
DIAMETER
NOM
0.55
BALL
TOP VIEW
0.70
0.60
0.50
15.00
BSC SQ
196-Lead Chip Scale Ball Grid Array [CSPBGA]
COPLANARITY
DETAIL A
MAX BALL
OUTLINE DIMENSIONS
Dimensions shown in millimeters
ORDERING GUIDE
0.20
DETAIL A
Instruction
Rate
60 MHz
60 MHz
60 MHz
66 MHz
66 MHz
60 MHz
–44–
13.00
BSC
SEATING PLANE
0.60
0.50
0.35
1.00 BSC
0.75
0.70
0.65
14
On-Chip
SRAM
544 Kbit
544 Kbit
544 Kbit
544 Kbit
544 Kbit
544 Kbit
DETAIL B
13
12
1.10
1.00
0.90
11
BOTTOM VIEW
10
13.00 BSC
9 8 7 6 5 4 3 2 1
1.00 BSC
1.10
1.00
0.90
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Operating
Voltage
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
DETAIL B
Package
Options
MQFP
MQFP
MQFP
Mini-BGA
Mini-BGA
Mini-BGA
REV. C
Page