CY7C1315BV18-200BZXC Cypress Semiconductor Corp, CY7C1315BV18-200BZXC Datasheet

SRAM (Static RAM)

CY7C1315BV18-200BZXC

Manufacturer Part Number
CY7C1315BV18-200BZXC
Description
SRAM (Static RAM)
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1315BV18-200BZXC

Format - Memory
RAM
Memory Type
SRAM - Synchronous, QDR II
Memory Size
18M (512K x 36)
Speed
200MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 70°C
Package / Case
165-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1315BV18-200BZXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
18-Mbit QDR™-II SRAM 4-Word Burst Architecture
Features
Configurations
CY7C1311BV18 – 2M x 8
CY7C1911BV18 – 2M x 9
CY7C1313BV18 – 1M x 18
CY7C1315BV18 – 512K x 36
Selection Guide
Cypress Semiconductor Corporation
Document Number: 38-05620 Rev. *F
Maximum Operating Frequency
Maximum Operating Current
Separate independent read and write data ports
300 MHz clock for high bandwidth
4-word burst for reducing address bus frequency
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 600 MHz) at 300 MHz
Two input clocks (K and K) for precise DDR timing
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
Available in x8, x9, x18, and x36 configurations
Full data coherency, providing most current data
Core V
Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
Variable drive HSTL output buffers
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Supports concurrent transactions
SRAM uses rising edges only
DD
= 1.8 (±0.1V); IO V
Description
DDQ
= 1.4V to V
x18
x36
x8
x9
300 MHz
300
765
800
840
985
DD
198 Champion Court
278 MHz
278
720
730
760
910
18-Mbit QDR™-II SRAM 4-Word
Functional Description
The CY7C1311BV18, CY7C1911BV18, CY7C1313BV18, and
CY7C1315BV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR™-II architecture. QDR-II architecture
consists of two separate ports: the read port and the write port to
access the memory array. The read port has dedicated data
outputs to support read operations and the write port has
dedicated data inputs to support write operations. QDR-II archi-
tecture has separate data inputs and data outputs to completely
eliminate the need to “turn-around” the data bus required with
common IO devices. Access to each port is accomplished
through a common address bus. Addresses for read and write
addresses are latched on alternate rising edges of the input (K)
clock. Accesses to the QDR-II read and write ports are
completely independent of one another. To maximize data
throughput, both read and write ports are provided with DDR
interfaces. Each address location is associated with four 8-bit
words (CY7C1311BV18), 9-bit words (CY7C1911BV18), 18-bit
words (CY7C1313BV18), or 36-bit words (CY7C1315BV18) that
burst sequentially into or out of the device. Because data can be
transferred into and out of the device on every rising edge of both
input clocks (K and K and C and C), memory bandwidth is
maximized while simplifying system design by eliminating bus
“turn-arounds”.
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
CY7C1313BV18, CY7C1315BV18
250 MHz
CY7C1311BV18, CY7C1911BV18
250
665
675
705
830
San Jose
,
CA 95134-1709
200 MHz
Burst Architecture
200
560
570
590
675
Revised February 02, 2011
167 MHz
167
495
490
505
570
408-943-2600
MHz
Unit
mA
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Related parts for CY7C1315BV18-200BZXC

CY7C1315BV18-200BZXC Summary of contents

Page 1

... DDR interfaces. Each address location is associated with four 8-bit words (CY7C1311BV18), 9-bit words (CY7C1911BV18), 18-bit words (CY7C1313BV18), or 36-bit words (CY7C1315BV18) that burst sequentially into or out of the device. Because data can be transferred into and out of the device on every rising edge of both ...

Page 2

... D [8:0] 19 Address A (18:0) Register K CLK K Gen. DOFF V REF Control WPS Logic BWS [0] Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 Write Write Write Write Address Reg Reg Reg Reg Register Control Logic Read Data Reg Reg. Reg. 16 Reg. Write Write ...

Page 3

... Logic Block Diagram (CY7C1313BV18 [17:0] 18 Address A (17:0) Register K CLK K Gen. DOFF V REF Control WPS Logic BWS [1:0] Logic Block Diagram (CY7C1315BV18 [35:0] 17 Address A (16:0) Register K CLK K Gen. DOFF V REF Control WPS Logic BWS [3:0] Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 ...

Page 4

... Performing a TAP Reset ........................................... 14 TAP Registers ........................................................... 14 TAP Instruction Set ................................................... 14 TAP Controller State Diagram ....................................... 16 TAP Controller Block Diagram ...................................... 17 Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 TAP Electrical Characteristics ...................................... 17 TAP AC Switching Characteristics ............................... 18 TAP Timing and Test Conditions .................................. 18 Identification Register Definitions ................................ 19 Scan Register Sizes ....................................................... 19 Instruction Codes ........................................................... 19 Boundary Scan Order ...

Page 5

... Pin Configuration The pin configuration for CY7C1311BV18, CY7C1911BV18, CY7C1313BV18, and CY7C1315BV18 follow NC/72M DOFF V V REF DDQ TDO TCK NC/72M DOFF V V REF DDQ TDO TCK A Note 1. NC/36M, NC/72M, NC/144M, and NC/288M are not connected to the die and can be tied to any voltage level. ...

Page 6

... Pin Configuration (continued) The pin configuration for CY7C1311BV18, CY7C1911BV18, CY7C1313BV18, and CY7C1315BV18 follow NC/144M NC/36M D10 D NC D11 Q10 Q11 F NC Q12 D12 G NC D13 Q13 H DOFF V V REF DDQ D14 Q14 L NC Q15 D15 D16 N NC D17 Q16 Q17 R TDO ...

Page 7

... CY7C1311BV18 arrays each of 512K x 9) for CY7C1911BV18, arrays each of 256K x 18) for CY7C1313BV18 and 512K arrays each of 128K x 36) for CY7C1315BV18. Therefore, only 19 address inputs are needed to access the entire memory array of CY7C1311BV18 and CY7C1911BV18, 18 address inputs for CY7C1313BV18 and 17 address inputs for CY7C1315BV18 ...

Page 8

... Ground for the Device Power Supply Power Supply Inputs for the Outputs of the Device. DDQ Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 Pin Description Switching Characteristics on page 25. Switching Characteristics on page 25. output impedance are set to 0.2 x RQ, where resistor connected [x:0] ...

Page 9

... Functional Overview The CY7C1311BV18, CY7C1911BV18, CY7C1315BV18 are synchronous pipelined Burst SRAMs with a read port and a write port. The read port is dedicated to read operations and the write port is dedicated to write operations. Data flows into the SRAM through the write port and flows out through the read port ...

Page 10

... All pending transactions (read and write) are completed before the device is deselected. Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 Programmable Impedance An external resistor, RQ, must be connected between the ZQ pin on the SRAM and V to allow the SRAM to adjust its output SS driver impedance ...

Page 11

... MASTER BWS# (CPU CLKIN/CLKIN# or Source K ASIC) Source K# Delayed K Delayed 50ohms Truth Table The truth table for CY7C1311BV18, CY7C1911BV18, CY7C1313BV18, and CY7C1315BV18 follows. Operation K RPS WPS [8] Write Cycle: L-H H Load address on the rising edge of K; write data on two consecutive K and K rising edges. [9] ...

Page 12

... Note 10. Is based on a write cycle that was initiated in accordance with the different portions of a write cycle, as long as the setup and hold requirements are achieved. Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 [2, 10] Comments ) are written into the device. [7:0] ) are written into the device ...

Page 13

... Write Cycle Descriptions The write cycle description table for CY7C1315BV18 follows. BWS BWS BWS BWS L– – L– – L– – L– – L– – L– – Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 [2, 10] K Comments – During the data portion of a write sequence, all four bytes (D the device. L– ...

Page 14

... IDCODE The IDCODE instruction loads a vendor-specific, 32-bit code into Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 Instruction Register Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the TDI and TDO pins, as shown in page 17 ...

Page 15

... Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 The shifting of data for the SAMPLE and PRELOAD phases can occur concurrently when required, that is, while the data captured is shifted out, the preloaded data can be shifted in. ...

Page 16

... The state diagram for the TAP controller follows. TEST-LOGIC 1 RESET 0 1 TEST-LOGIC/ 0 IDLE Note 11. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 [11] 1 SELECT DR-SCAN 0 1 CAPTURE- SHIFT- ...

Page 17

... These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the 13. Overshoot: V (AC) < 0.85V (Pulse width less than t IH DDQ 14. All Voltage referenced to Ground. Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 0 Bypass Register Instruction Register ...

Page 18

... CS CH 16. Test conditions are specified using the load in TAP AC Test Conditions. t Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 Description [16] Figure 2. TAP Timing and Test Conditions 0.9V 1.8V 50 ...

Page 19

... Do not use: This instruction is reserved for future use. BYPASS 111 Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 Value CY7C1911BV18 CY7C1313BV18 000 000 00000110100 00000110100 ...

Page 20

... Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 Bump ID Bit # Bump ID 11H 54 7B 10G 11F 57 5B 11G 10F 60 5C 11E 61 4B 10E 62 3A 10D 10C 65 2B 11D 66 3B ...

Page 21

... DDQ DOFF Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 DLL Constraints DLL uses K clock as its synchronizing input. The input must ■ have low phase jitter, which is specified as t The DLL functions at frequencies down to 120 MHz. ■ If the input clock is unstable and the DLL is enabled, then the ■ ...

Page 22

... V REF DDQ 21. The operation current is calculated with 50% read cycle and 50% write cycle. Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 Current into Outputs (LOW) ........................................ 20 mA Static Discharge Voltage (MIL-STD-883, M. 3015).. > 2001V Latch up Current.................................................... > 200 mA Operating Range Range Commercial ...

Page 23

... I Automatic Power Down SB1 Current AC Electrical Characteristics [13] Over the Operating Range Parameter Description V Input HIGH Voltage IH V Input LOW Voltage IL Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 Test Conditions V = Max, 200 MHz (x8 mA, OUT (x9 1/t MAX CYC (x18) (x36) 167 MHz ...

Page 24

... Unless otherwise noted, test conditions are based on signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V 250, V pulse levels of 0.25V to 1.25V, and output loading of the specified I Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 Test Conditions T = 25 MHz ...

Page 25

... This part has a voltage regulator internally; t POWER initiated. 25. For D2 data signal on CY7C1911BV18 device, t Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 300 MHz 278 MHz Min Max Min Max Min Max Min Max Min Max [24 ...

Page 26

... CHZ CLZ 27. At any voltage and temperature t is less than t CHZ Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 300 MHz 278 MHz Min Max Min Max Min Max Min Max Min Max – 0.45 – 0.45 – ...

Page 27

... Outputs are disabled (High-Z) one clock cycle after a NOP. 30. In this example, if address A2 = A1, then data Q20 = D10, Q21 = D11, Q22 = D12, and Q23 = D13. Write data is forwarded immediately as read results. This note applies to the whole diagram. Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 [28, 29, 30] WRITE READ WRITE ...

Page 28

... Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives and distributors. To find the office closest to you, visit us at http://www.cypress.com/go/datasheet/offices. Speed (MHz) Ordering Code 250 CY7C1315BV18-250BZXC 200 CY7C1315BV18-200BZXC CY7C1315BV18-200BZI CY7C1315BV18-200BZXI Ordering Code Definitions CY 7C 1315 B V18 - XXX XXX Document Number: 38-05620 Rev. *F ...

Page 29

... Package Diagram Figure 6. 165-Ball FBGA ( 1.4 mm), 51-85180 Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 51-85180 *C Page [+] Feedback ...

Page 30

... Document History Page Document Title: CY7C1311BV18/CY7C1911BV18/CY7C1313BV18/CY7C1315BV18, 18-Mbit QDR™-II SRAM 4-Word Burst Architecture Document Number: 38-05620 Submission Orig. of Rev. ECN No. Date Change ** 252474 See ECN SYT *A 325581 See ECN SYT *B 413997 See ECN NXR *C 472384 See ECN NXR Document Number: 38-05620 Rev. *F ...

Page 31

... Document History Page Document Title: CY7C1311BV18/CY7C1911BV18/CY7C1313BV18/CY7C1315BV18, 18-Mbit QDR™-II SRAM 4-Word Burst Architecture Document Number: 38-05620 Submission Orig. of Rev. ECN No. Date Change *D 2511674 06/03/08 VKN/PYRS Updated Logic Block diagrams *E 2898958 03/25/10 NJY *F 3160393 02/02/2011 NJY Document Number: 38-05620 Rev. *F CY7C1311BV18, CY7C1911BV18 ...

Page 32

... QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress, Hitachi, IDT, NEC, and Samsung. All product and company names mentioned in this document are the trademarks of their respective holders. CY7C1311BV18, CY7C1911BV18 CY7C1313BV18, CY7C1315BV18 cypress.com/go/plc Revised February 02, 2011 PSoC Solutions psoc ...

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