MBRP40030CTL ON Semiconductor, MBRP40030CTL Datasheet
MBRP40030CTL
Specifications of MBRP40030CTL
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MBRP40030CTL Summary of contents
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... Mold Compound Code A = Assembly Location YY = Year WW = Work Week G = Pb−Free Package ORDERING INFORMATION Device Package Shipping MBRP40030CTL POWERTAP II 25 Units/Tray MBRP40030CTLG POWERTAP II 25 Units/Tray (Pb−Free) Preferred devices are recommended choices for future use and best overall value. Publication Order Number: MBRP40030CTL/D ...
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THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Case (Note 1) ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 200 Amps 25° 200 Amps 100° Maximum Instantaneous Reverse Current ...
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T = 150° 100°C J 0.01 0.001 T = 25°C J 0.0001 REVERSE VOLTAGE (VOLTS) R Figure 3. Typical Reverse Current 100000 10000 1000 ...
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MAXIMUM MECHANICAL RATINGS Terminal Penetration: 0.235 max Terminal Torque: 25−40 in-lb max Mounting Torque − Outside Holes: 30−40 in-lb max Mounting Torque − Center Hole: 8−10 in-lb max Seating Plane 1 mil per in. Flatness (between mounting holes) Note: While ...
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... Q 0.270 0.285 6.86 7.23 R 31.50 BSC 80.01 BSC U 0.600 0.630 15.24 16.00 V 0.330 0.375 8.39 9.52 W 0.170 0.190 4.32 4.82 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MBRP40030CTL/D ...