BLF368 NXP Semiconductors, BLF368 Datasheet - Page 3

RF MOSFET Power BULK TNS-RFUH

BLF368

Manufacturer Part Number
BLF368
Description
RF MOSFET Power BULK TNS-RFUH
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BLF368

Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Product Type
MOSFET Power
Resistance Drain-source Rds (on)
0.15 Ohms
Transistor Polarity
N-Channel
Configuration
Dual Common Source
Drain-source Breakdown Voltage
65 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
25 A
Power Dissipation
500 W
Maximum Operating Temperature
+ 200 C
Package / Case
SOT-262-5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BLF368,112

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Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
THERMAL CHARACTERISTICS
2003 Sep 26
handbook, halfpage
Per transistor section unless otherwise specified
V
V
I
P
T
T
R
R
SYMBOL
SYMBOL
D
stg
j
DS
GS
tot
th j-mb
th mb-h
VHF push-pull power MOS transistor
(1) Current in this area may be limited by R
(2) T
Total device; both sections equally loaded.
(A)
10
I D
10
mb
1
2
1
= 25 C.
drain-source voltage
gate-source voltage
drain current (DC)
total power dissipation T
storage temperature
junction temperature
thermal resistance from junction to mounting base total device; both sections
thermal resistance from mounting base to
heatsink
(1)
PARAMETER
Fig.2 DC SOAR.
10
PARAMETER
(2)
V DS (V)
DSon
mb
.
25 C total device; both sections equally loaded
MRA933
10
2
CONDITIONS
3
handbook, halfpage
(1) Continuous operation.
(2) Short-time operation during mismatch.
Total device; both sections equally loaded.
equally loaded
total device; both sections
equally loaded
P tot
(W)
500
400
300
200
100
0
CONDITIONS
0
Fig.3 Power derating curves.
40
(1)
80
(2)
MIN.
65
VALUE
0.35
0.15
Product specification
120
65
25
500
+150
200
T h ( C)
MAX.
20
BLF368
MGE616
160
UNIT
K/W
K/W
V
V
A
W
C
C
UNIT

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