LPC2364HBD100 NXP Semiconductors, LPC2364HBD100 Datasheet - Page 3

• Manufacturer Part Number: LPC2364HBD100
• Description: LPC2364HBD100/LQFP100/TRAYBDP/
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2364HBD100

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 34K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 100-LQFP
• Processor Series: LPC23
• Core: ARM7TDMI-S
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
LPC2364_65_66_67_68_6
Product data sheet
Type number
LPC2364FBD100
LPC2364HBD100
LPC2364FET100
LPC2365FBD100
LPC2366FBD100
LPC2367FBD100
LPC2368FBD100
LPC2368FET100
Ordering information
Package
Name
LQFP100
LQFP100
TFBGA100
LQFP100
LQFP100
LQFP100
LQFP100
TFBGA100
On-chip PLL allows CPU operation up to the maximum CPU rate without the need for
a high frequency crystal. May be run from the main oscillator, the internal RC oscillator,
or the RTC oscillator.
Boundary scan for simplified board testing is available in LPC2364FET100 and
LPC2368FET100 (TFBGA package).
Versatile pin function selections allow more possibilities for using on-chip peripheral
functions.
Industrial control
Medical systems
Protocol converter
Communications
Description
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic thin fine-pitch ball grid array package; 100 balls; body 9 × 9 × 0.7 mm SOT926-1
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic thin fine-pitch ball grid array package; 100 balls; body 9 × 9 × 0.7 mm SOT926-1
Rev. 06 — 1 February 2010
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
© NXP B.V. 2010. All rights reserved.
Version
SOT407-1
SOT407-1
SOT407-1
SOT407-1
SOT407-1
SOT407-1
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