LPC2364HBD100 NXP Semiconductors, LPC2364HBD100 Datasheet - Page 42

• Manufacturer Part Number: LPC2364HBD100
• Description: LPC2364HBD100/LQFP100/TRAYBDP/
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2364HBD100

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 34K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 100-LQFP
• Processor Series: LPC23
• Core: ARM7TDMI-S
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

NXP Semiconductors
LPC2364_65_66_67_68_6
Product data sheet
9.2 Deep power-down mode
Fig 7.
Fig 8.
I
DD(DCDC)pd(3v3)
I
DD(IO)
(μA)
800
600
400
200
300
200
100
(μA)
V
Total DC-to-DC converter supply current I
in Power-down mode
I/O maximum supply current I
mode
V
0
0
−40
DD(3V3)
−40
DD(3V3)
= V
= V
i(VBAT)
DD(DCDC)(3V3)
Rev. 06 — 1 February 2010
V
V
−15
−15
DD(DCDC)(3V3)
DD(DCDC)(3V3)
= 3.3 V; T
V
V
DD(3V3)
DD(3V3)
= 3.3 V; T
amb
= 3.3 V
= 3.0 V
= 3.3 V
= 3.0 V
= 25 °C.
10
10
amb
DD(IO)
= 25 °C.
versus temperature in Deep power-down
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
DD(DCDC)pd(3V3)
35
35
at different temperatures
60
60
temperature (°C)
temperature (°C)
002aae051
002aae046
© NXP B.V. 2010. All rights reserved.
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