LPC2364HBD100 NXP Semiconductors, LPC2364HBD100 Datasheet - Page 44

• Manufacturer Part Number: LPC2364HBD100
• Description: LPC2364HBD100/LQFP100/TRAYBDP/
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2364HBD100

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 34K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 100-LQFP
• Processor Series: LPC23
• Core: ARM7TDMI-S
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

NXP Semiconductors
10. Dynamic characteristics
Table 7.
T
over specified ranges.
[1]
[2]
[3]
[4]
Table 8.
C
LPC2364_65_66_67_68_6
Product data sheet
Symbol
ARM processor clock frequency
f
External clock
f
T
t
t
t
t
I
t
SSP interface
t
Symbol
t
t
t
V
t
t
t
oper
osc
CHCX
CLCX
CLCH
CHCL
2
f(o)
su(SPI_MISO)
r
f
FRFM
FEOPT
FDEOP
JR1
amb
L
cy(clk)
C-bus pins (P0[27] and P0[28])
CRS
= 50 pF; R
Parameters are valid over operating temperature range unless otherwise specified.
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
LPC2364HBD only.
Bus capacitance C
=
−
40
°
Dynamic characteristics
Dynamic characteristics of USB pins (full-speed) (LPC2364/66/68 only)
C to +85
pu
Parameter
operating frequency
oscillator frequency
clock cycle time
clock HIGH time
clock LOW time
clock rise time
clock fall time
output fall time
SPI_MISO set-up time
= 1.5 k
Parameter
rise time
fall time
differential rise and fall time
matching
output signal crossover voltage
source SE0 interval of EOP
source jitter for differential transition
to SE0 transition
receiver jitter to next transition
b
°
[1]
C for standard devices,
in pF, from 10 pF to 400 pF.
Ω
on D+ to V
DD(3V3)
, unless otherwise specified.
Conditions
CCLK; −40 °C to +85 °C
CCLK; > 85 °C
IRC; −40 °C to +85 °C
IRC; > 85 °C
V
T
in SPI Master mode; see
Figure 13
−
IH
amb
40
to V
Rev. 06 — 1 February 2010
°
= 25 °C; measured
C to +125
IL
Conditions
10 % to 90 %
10 % to 90 %
see
see
t
r
/ t
f
Figure 12
Figure 12
°
C for LPC2364HBD only, unless otherwise specified; V
[3]
[3]
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
Min
1
1
3.96
3.98
1
42
T
T
-
-
20 + 0.1 × C
-
cy(clk)
cy(clk)
Min
8.5
7.7
-
1.3
160
−2
−18.5
× 0.4
× 0.4
b
[4]
Typ
-
-
-
-
-
-
-
Typ
-
-
4
4.02
-
-
-
-
-
-
-
11
[2]
© NXP B.V. 2010. All rights reserved.
Max
13.8
13.7
109
2.0
175
+5
+18.5
Max
72
60
4.04
4.06
25
1000
-
-
5
5
-
-
Unit
MHz
MHz
MHz
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
Unit
ns
ns
%
V
ns
ns
ns
44 of 59
DD(3V3)