LPC2364HBD100 NXP Semiconductors, LPC2364HBD100 Datasheet - Page 46

• Manufacturer Part Number: LPC2364HBD100
• Description: LPC2364HBD100/LQFP100/TRAYBDP/
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2364HBD100

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 34K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 100-LQFP
• Processor Series: LPC23
• Core: ARM7TDMI-S
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

NXP Semiconductors
LPC2364_65_66_67_68_6
Product data sheet
Fig 11. External clock timing (with an amplitude of at least V
Fig 12. Differential data-to-EOP transition skew and EOP width
Fig 13. MISO line set-up time in SSP Master mode
T
PERIOD
differential
data lines
10.1 Timing
MOSI
MISO
shifting edges
SCK
n × T
differential data to
crossover point
SE0/EOP skew
PERIOD
+ t
FDEOP
t
CHCL
Rev. 06 — 1 February 2010
t
su(SPI_MISO)
t
CLCX
crossover point
i(RMS)
T
extended
cy(clk)
= 200 mV)
t
CLCH
LPC2364/65/66/67/68
t
Single-chip 16-bit/32-bit microcontrollers
CHCX
sampling edges
002aaa907
source EOP width: t
receiver EOP width: t
002aad326
© NXP B.V. 2010. All rights reserved.
FEOPT
002aab561
EOPR1
, t
EOPR2
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