LPC2364HBD100 NXP Semiconductors, LPC2364HBD100 Datasheet - Page 53

• Manufacturer Part Number: LPC2364HBD100
• Description: LPC2364HBD100/LQFP100/TRAYBDP/
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2364HBD100

• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 34K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 100-LQFP
• Processor Series: LPC23
• Core: ARM7TDMI-S
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

NXP Semiconductors
Fig 20. Package outline SOT926-1 (TFBGA100)
LPC2364_65_66_67_68_6
Product data sheet
TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT926-1
VERSION
OUTLINE
max
1.2
A
ball A1
index area
ball A1
index area
0.4
0.3
A
1
G
K
H
D
C
B
A
F
E
J
0.65
0.8
A
2
1
IEC
- - -
2
0.5
0.4
b
e
3
9.1
8.9
4
D
5
e
D
1
9.1
8.9
JEDEC
6
E
- - -
1/2 e
7
REFERENCES
0.8
e
8
Rev. 06 — 1 February 2010
b
9
0
7.2
e
10
1
JEITA
7.2
e
- - -
2
1/2 e
scale
B
e
2.5
∅ v
∅ w
0.15
v
M
M
e
A
E
2
C
C
0.05
A
w
5 mm
A
B
0.08
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
A
y
1
A
2
0.1
y
1
y
1
C
detail X
PROJECTION
EUROPEAN
X
C
y
© NXP B.V. 2010. All rights reserved.
ISSUE DATE
05-12-09
05-12-22
SOT926-1
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