BAW56,215 NXP Semiconductors, BAW56,215 Datasheet
BAW56,215
Specifications of BAW56,215
933098990215
BAW56 T/R
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BAW56,215 Summary of contents
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BAV756S; BAW56 series High-speed switching diodes Rev. 05 — 26 November 2007 1. Product profile 1.1 General description High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number Package BAV756S BAW56 BAW56M BAW56S BAW56T BAW56W ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin BAV756S BAW56; BAW56T; BAW56W BAW56M BAW56S BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series Pinning Description anode (diode 1) cathode (diode 2) common anode (diode 2 and diode 3) cathode (diode 3) anode (diode 4) common cathode (diode 1 and diode 4) cathode (diode 1) ...
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... NXP Semiconductors 3. Ordering information Table 4. Type number BAV756S BAW56 BAW56M BAW56S BAW56T BAW56W 4. Marking Table 5. Type number BAV756S BAW56 BAW56M BAW56S BAW56T BAW56W [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). ...
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... NXP Semiconductors Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol I FRM I FSM P tot Per device amb T stg [ prior to surge. j [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [3] Reflow soldering is the only recommended soldering method. ...
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... NXP Semiconductors Table 7. Symbol R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. 7. Characteristics Table unless otherwise specified. amb Symbol Per diode [1] Pulse test: t [2] When switched from I [3] ...
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... NXP Semiconductors (mA (1) (2) (3) ( 0.2 0.6 ( 150 C amb ( amb ( amb ( amb Fig 1. Forward current as a function of forward voltage; typical values ( ( ( ( ( 150 C amb ( amb ( amb ( amb Fig 3. Reverse current as a function of reverse voltage; typical values BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series ...
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... NXP Semiconductors 8. Test information D.U. ( Input signal: reverse pulse rise time t Oscilloscope: rise time Fig 5. Reverse recovery time test circuit and waveforms 450 D.U.T. Input signal: forward pulse rise time t Fig 6. Forward recovery voltage test circuit and waveforms BAV756S_BAW56_SER_5 Product data sheet BAV756S ...
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... NXP Semiconductors 9. Package outline 3.0 2.8 3 2.5 1.4 2.1 1.2 1 1.9 Dimensions in mm Fig 7. Package outline BAW56 (SOT23/TO-236AB) 2.2 1 2.2 1.35 2.0 1.15 pin 1 index 1 2 0.65 1.3 Dimensions in mm Fig 9. Package outline BAV756S and BAW56S (SOT363/SC-88) Fig 11. Package outline BAW56W (SOT323/SC-70) ...
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... NXP Semiconductors 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BAV756S BAW56 BAW56M BAW56S BAW56T BAW56W [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping 11. Soldering Fig 12. Refl ...
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... NXP Semiconductors 4.60 Fig 13. Wave soldering footprint BAW56 (SOT23/TO-236AB) Fig 14. Reflow soldering footprint BAW56M (SOT883/SC-101) BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series 3.40 1.20 (2x) 2 4.00 1.20 3 2.80 4. 0.05 ( 0.90 0. solder lands solder paste Reflow soldering is the only recommended soldering method. ...
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... NXP Semiconductors Fig 15. Reflow soldering footprint BAV756S and BAW56S (SOT363/SC-88) Dimensions in mm Fig 16. Wave soldering footprint BAV756S and BAW56S (SOT363/SC-88) BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series 2.35 solder lands 0.50 solder paste (4 ) solder resist 0.50 occupied area (4 ) Dimensions ...
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... NXP Semiconductors Fig 17. Reflow soldering footprint BAW56T (SOT416/SC-75) Fig 18. Reflow soldering footprint BAW56W (SOT323/SC-70) Fig 19. Wave soldering footprint BAW56W (SOT323/SC-70) BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series 2.0 0.85 0.6 (3x) Dimensions in mm 2.65 0.75 1.325 1. 0.60 2. 2.40 4 ...
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... BAV756S; BAW56 series Data sheet status Product data sheet The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Type number BAW56M added Section 1.1 “General description” ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Revision history ...