DIODE SW 200V 200MA HS UMT3

 

BAS21AW,115

Manufacturer Part NumberBAS21AW,115
DescriptionDIODE SW 200V 200MA HS UMT3
ManufacturerNXP Semiconductors
BAS21AW,115 datasheets

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Specifications of BAS21AW,115

Package / CaseSC-70-3, SOT-323-3Voltage - Forward (vf) (max) @ If1V @ 100mA
Current - Reverse Leakage @ Vr100nA @ 200VCurrent - Average Rectified (io) (per Diode)125mA (DC)
Voltage - Dc Reverse (vr) (max)250VReverse Recovery Time (trr)50ns
Diode TypeStandardSpeedSmall Signal =< 200mA (Io), Any Speed
Diode Configuration1 Pair Common AnodeMounting TypeSurface Mount
ProductSwitching DiodesPeak Reverse Voltage250 V
Forward Continuous Current125 mAMax Surge Current625 mA
ConfigurationDual Common AnodeRecovery Time50 ns
Forward Voltage Drop1.25 VMaximum Reverse Leakage Current100 nA
Maximum Power Dissipation200 mWOperating Temperature Range- 55 C to + 150 C
Maximum Diode Capacitance2 pFMaximum Operating Temperature+ 150 C
Minimum Operating Temperature- 55 CMounting StyleSMD/SMT
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names934063269115
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BAS21W series
High-voltage switching diodes
Rev. 01 — 9 October 2009
1. Product profile
1.1 General description
High-voltage switching diodes, encapsulated in a very small Surface-Mounted
Device (SMD) plastic package.
Table 1.
Type number
BAS21W
BAS21AW
BAS21SW
1.2 Features
I
High switching speed: t
I
Low leakage current
I
High reverse voltage: V
1.3 Applications
I
High-speed switching
I
General-purpose switching
1.4 Quick reference data
Table 2.
Symbol
Per diode
I
F
I
R
V
R
t
rr
[1]
Single diode loaded.
[2]
When switched from I
Product overview
Configuration
single
dual common anode
dual series
50 ns
rr
250 V
R
Quick reference data
Parameter
Conditions
forward current
reverse current
V
= 200 V
R
reverse voltage
reverse recovery time
= 10 mA to I
= 10 mA; R
F
R
Product data sheet
Package
Package
configuration
NXP
JEDEC
SOT323
SC-70
very small
I
Low capacitance: C
d
I
Very small SMD plastic package
I
AEC-Q101 qualified
I
Voltage clamping
I
Reverse polarity protection
Min
Typ
[1]
-
-
-
-
-
-
[2]
-
-
= 100 ; measured at I
= 1 mA.
L
R
2 pF
Max
Unit
225
mA
100
nA
250
V
50
ns

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BAS21AW,115 Summary of contents

  • Page 1

    BAS21W series High-voltage switching diodes Rev. 01 — 9 October 2009 1. Product profile 1.1 General description High-voltage switching diodes, encapsulated in a very small Surface-Mounted Device (SMD) plastic package. Table 1. Type number BAS21W BAS21AW BAS21SW 1.2 Features I ...

  • Page 2

    ... NXP Semiconductors 2. Pinning information Table 3. Pin BAS21W BAS21AW BAS21SW Ordering information Table 4. Type number BAS21W BAS21AW BAS21SW BAS21W_SER_1 Product data sheet Pinning Description anode not connected cathode cathode (diode 1) cathode (diode 2) common anode anode (diode 1) cathode (diode 2) cathode (diode 1), anode (diode 2) ...

  • Page 3

    ... NXP Semiconductors 4. Marking Table 5. Type number BAS21W BAS21AW BAS21SW [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode FRM I FSM Per device P tot amb ...

  • Page 4

    ... NXP Semiconductors 6. Thermal characteristics Table 7. Symbol Per device R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 7. Characteristics Table unless otherwise specified. amb Symbol Per diode [1] When switched from I BAS21W_SER_1 Product data sheet Thermal characteristics Parameter ...

  • Page 5

    ... NXP Semiconductors 600 I F (mA) 400 200 ( 0.4 0.8 ( 150 C amb ( amb ( amb ( amb Fig 1. Forward current as a function of forward voltage; typical values ( 150 C amb ( amb ( amb ( amb Fig 3. Reverse current as a function of reverse voltage; typical values BAS21W_SER_1 Product data sheet 006aab212 ...

  • Page 6

    ... NXP Semiconductors 1 (pF) 0.8 0.6 0.4 0 MHz amb Fig 4. Diode capacitance as a function of reverse voltage; typical values 8. Test information D.U. ( Fig 6. Reverse recovery time test circuit and waveforms 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualifi ...

  • Page 7

    ... NXP Semiconductors 9. Package outline Fig 7. 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BAS21W BAS21AW BAS21SW [1] For further information and the availability of packing methods, see BAS21W_SER_1 Product data sheet 2.2 1.8 2 ...

  • Page 8

    ... NXP Semiconductors 11. Soldering Fig 8. 3.65 2.1 Fig 9. BAS21W_SER_1 Product data sheet 2.65 1.85 1.325 2 0 Reflow soldering footprint SOT323 (SC-70) 4.6 2.575 1.425 (3 ) Wave soldering footprint SOT323 (SC-70) Rev. 01 — 9 October 2009 BAS21W series High-voltage switching diodes solder lands ...

  • Page 9

    ... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID Release date BAS21W_SER_1 20091009 BAS21W_SER_1 Product data sheet Data sheet status Change notice Product data sheet - Rev. 01 — 9 October 2009 BAS21W series High-voltage switching diodes Supersedes - © NXP B.V. 2009. All rights reserved. ...

  • Page 10

    ... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

  • Page 11

    ... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Packing information Soldering ...

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