BAS16L,315 NXP Semiconductors, BAS16L,315 Datasheet

DIODE SW 100V 215MA H-S SOD882

BAS16L,315

Manufacturer Part Number
BAS16L,315
Description
DIODE SW 100V 215MA H-S SOD882
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAS16L,315

Package / Case
SOD-882
Voltage - Forward (vf) (max) @ If
1.25V @ 150mA
Voltage - Dc Reverse (vr) (max)
100V
Current - Average Rectified (io)
215mA (DC)
Current - Reverse Leakage @ Vr
500nA @ 80V
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
4ns
Capacitance @ Vr, F
1.5pF @ 0V, 1MHz
Mounting Type
Surface Mount
Product
Switching Diodes
Peak Reverse Voltage
100 V
Forward Continuous Current
215 mA
Max Surge Current
4 A
Configuration
Single
Recovery Time
4 ns
Forward Voltage Drop
1.25 V
Maximum Reverse Leakage Current
1 uA
Operating Temperature Range
+ 150 C
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-4859-2
934057247315
BAS16L T/R
BAS16L T/R
BAS16L,315

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAS16L,315
Manufacturer:
NXP/恩智浦
Quantity:
20 000
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD)
plastic packages.
Table 1.
I
I
I
I
I
Type number
BAS16
BAS16H
BAS16J
BAS16L
BAS16T
BAS16VV
BAS16VY
BAS16W
BAS316
BAS516
BAS16 series
High-speed switching diodes
Rev. 05 — 25 August 2008
High switching speed: t
Low leakage current
Repetitive peak reverse voltage:
V
High-speed switching
General-purpose switching
RRM
Product overview
100 V
Package
NXP
SOT23
SOD123F
SOD323F
SOD882
SOT416
SOT666
SOT363
SOT323
SOD323
SOD523
rr
JEITA
-
-
SC-90
-
SC-75
-
SC-88
SC-70
SC-76
SC-79
4 ns
JEDEC
TO-236AB
-
-
-
-
-
-
-
-
-
I
I
I
Low capacitance
Reverse voltage: V
Small SMD plastic packages
Configuration
single
single
single
single
single
triple isolated
triple isolated
single
single
single
Product data sheet
R
100 V
Package
configuration
small
small and flat lead
very small and flat
lead
leadless ultra
small
ultra small
ultra small and flat
lead
very small
very small
very small
ultra small and flat
lead

Related parts for BAS16L,315

BAS16L,315 Summary of contents

Page 1

BAS16 series High-speed switching diodes Rev. 05 — 25 August 2008 1. Product profile 1.1 General description High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number BAS16 BAS16H BAS16J BAS16L BAS16T BAS16VV BAS16VY BAS16W ...

Page 2

... NXP Semiconductors 1.4 Quick reference data Table 2. Symbol Per diode [1] When switched from I 2. Pinning information Table 3. Pin BAS16; BAS16T; BAS16W BAS16H; BAS16J; BAS316; BAS516 1 2 BAS16L 1 2 BAS16VV; BAS16VY [1] The marking bar indicates the cathode. BAS16_SER_5 Product data sheet Quick reference data ...

Page 3

... NXP Semiconductors 3. Ordering information Table 4. Type number BAS16 BAS16H BAS16J BAS16L BAS16T BAS16VV BAS16VY BAS16W BAS316 BAS516 4. Marking Table 5. Type number BAS16 BAS16H BAS16J BAS16L BAS16T BAS16VV BAS16VY BAS16W BAS316 BAS516 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China ...

Page 4

... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode V RRM FRM I FSM P tot BAS16_SER_5 Product data sheet Limiting values Parameter Conditions repetitive peak reverse voltage reverse voltage forward current BAS16 BAS16H BAS16L ...

Page 5

... NXP Semiconductors Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per device amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB with 60 m copper strip line. ...

Page 6

... NXP Semiconductors Table 7. Symbol R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB with 60 m copper strip line. [3] Reflow soldering is the only recommended soldering method. [4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm [5] Single diode loaded ...

Page 7

... NXP Semiconductors (mA (1) (2) (3) ( 0.2 0.4 0.6 0.8 ( 150 C amb ( amb ( amb ( amb Fig 1. Forward current as a function of forward voltage; typical values ( ( ( ( ( 150 C amb ( amb ( amb ( amb Fig 3. Reverse current as a function of reverse voltage; typical values BAS16_SER_5 Product data sheet 006aab132 ...

Page 8

... NXP Semiconductors 8. Test information D.U. ( Input signal: reverse pulse rise time t Oscilloscope: rise time Fig 5. Reverse recovery time test circuit and waveforms 450 D.U.T. Input signal: forward pulse rise time t Fig 6. Forward recovery voltage test circuit and waveforms 9. Package outline 3 ...

Page 9

... NXP Semiconductors 1.35 1.15 1 2.7 1.8 2.3 1.6 2 0.40 0.25 Dimensions in mm Fig 9. Package outline BAS16J (SOD323F/SC-90) 1.8 1.4 3 1.75 0.9 1.45 0 Dimensions in mm Fig 11. Package outline BAS16T (SOT416/SC-75) 2.2 1 2.2 1.35 2.0 1.15 pin 1 index 1 2 0.65 1.3 Dimensions in mm Fig 13 ...

Page 10

... NXP Semiconductors 1.35 1.15 1 2.7 1.8 2.3 1.6 2 0.40 0.25 Dimensions in mm Fig 15. Package outline BAS316 (SOD323/SC-76) 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BAS16 SOT23 BAS16H SOD123F ...

Page 11

... NXP Semiconductors 11. Soldering 3 1.7 Fig 17. Reflow soldering footprint BAS16 (SOT23/TO-236AB) 4.6 2.6 Fig 18. Wave soldering footprint BAS16 (SOT23/TO-236AB) BAS16_SER_5 Product data sheet 3.3 2.9 1 2 1.4 2.8 4.5 Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes ...

Page 12

... NXP Semiconductors Fig 19. Reflow soldering footprint BAS16H (SOD123F) 1.65 Fig 20. Reflow soldering footprint BAS16J (SOD323F) BAS16_SER_5 Product data sheet 4.4 4 2.9 1.6 2.1 1.6 1 Reflow soldering is the only recommended soldering method. Dimensions in mm 3.05 2.2 2.1 0.95 0 ...

Page 13

... NXP Semiconductors 0.9 Fig 21. Reflow soldering footprint BAS16L (SOD882) Fig 22. Reflow soldering footprint BAS16T (SOT416/SC-75) BAS16_SER_5 Product data sheet 1.3 0 Reflow soldering is the only recommended soldering method. 2.2 1.7 0.85 0 1.3 Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes R0 ...

Page 14

... NXP Semiconductors 2 1.7 Fig 23. Reflow soldering footprint BAS16VV (SOT666) Fig 24. Reflow soldering footprint BAS16VY (SOT363/SC-88) BAS16_SER_5 Product data sheet 2.75 2.45 2.1 1.6 0.538 0.55 1.075 (2 ) 1 Reflow soldering is the only recommended soldering method. 2.65 2.35 1.5 0.6 ...

Page 15

... NXP Semiconductors 4.5 Fig 25. Wave soldering footprint BAS16VY (SOT363/SC-88) Fig 26. Reflow soldering footprint BAS16W (SOT323/SC-70) BAS16_SER_5 Product data sheet 1.3 1.3 2.45 5.3 2.65 1.85 1.325 2 0 Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes 1.5 0.3 2.5 1 ...

Page 16

... NXP Semiconductors 3.65 2.1 Fig 27. Wave soldering footprint BAS16W (SOT323/SC-70) 1.65 Fig 28. Reflow soldering footprint BAS316 (SOD323/SC-76) BAS16_SER_5 Product data sheet 4.6 2.575 1.425 (3 ) 3.05 2.1 0.95 2 Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes 1.8 Dimensions in mm ...

Page 17

... NXP Semiconductors 2.75 Fig 29. Wave soldering footprint BAS316 (SOD323/SC-76) Fig 30. Reflow soldering footprint BAS516 (SOD523/SC-79) BAS16_SER_5 Product data sheet 5 2 2.15 1.1 1 Reflow soldering is the only recommended soldering method. Rev. 05 — 25 August 2008 BAS16 series High-speed switching diodes ...

Page 18

... Release date BAS16_SER_5 20080825 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Table 5 “Marking • Table 6 “Limiting V • ...

Page 19

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 20

... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12 Revision history ...

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