PMEG4002EL,315 NXP Semiconductors, PMEG4002EL,315 Datasheet
PMEG4002EL,315
Specifications of PMEG4002EL,315
934058009315
PMEG4002EL T/R
PMEG4002EL T/R
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PMEG4002EL,315 Summary of contents
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PMEG4002EL 40 V, 0.2 A low V Rev. 02 — 11 March 2009 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD882 ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Type number Package PMEG4002EL - 4. Marking Table 4. Type number PMEG4002EL 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol FRM I FSM ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) [1] Refer to SOD882 standard mounting conditions (footprint), FR4 Printed-Circuit Board (PCB) with 60 m copper strip line. [2] For Schottky barrier diodes thermal runaway has to be considered some applications the reverse power losses P power losses P 7. Characteristics Table 7 ...
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... NXP Semiconductors (mA (1) (2) (3) ( 200 ( 150 125 Fig 1. Forward current as a function of forward voltage; typical values MHz amb Fig 3. Diode capacitance as a function of reverse voltage; typical values PMEG4002EL_2 Product data sheet 40 V, 0.2 A low V 001aaa337 400 600 V (mV) F (1) T ...
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... NXP Semiconductors 8. Package outline Fig 4. 9. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PMEG4002EL SOD882 [1] For further information and the availability of packing methods, see 10. Soldering 0.9 Fig 5. PMEG4002EL_2 Product data sheet ...
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... Document ID Release date PMEG4002EL_2 20090311 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Figure • Section 9 “Packing • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 14. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 Legal information ...