STTH3L06 STMicroelectronics, STTH3L06 Datasheet

STTH3L06
Manufacturer Part Number	STTH3L06
Description	DIODE ULT FAST 600V 3A DO-201AD
Manufacturer	STMicroelectronics
STTH3L06 datasheets	1. STTH3L06U.pdf (10 pages)

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Specifications of STTH3L06
Voltage - Forward (vf) (max) @ If	1.3V @ 3A	Voltage - Dc Reverse (vr) (max)	600V
Current - Average Rectified (io)	3A	Current - Reverse Leakage @ Vr	3µA @ 600V
Diode Type	Standard	Speed	Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)	85ns	Mounting Type	Through Hole
Package / Case	DO-201AD, Axial	Product	Ultra Fast Recovery Rectifier
Configuration	Single	Reverse Voltage	600 V
Forward Voltage Drop	1.3 V	Recovery Time	85 ns
Forward Continuous Current	3 A	Max Surge Current	70 A
Reverse Current Ir	3 uA	Mounting Style	Through Hole
Maximum Operating Temperature	+ 175 C	Minimum Operating Temperature	- 65 C
Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Capacitance @ Vr, F	-
Other names	497-3246-3

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TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER

Table 1: Main Product Characteristics

F(AV)

RRM

(max)

(typ)

FEATURES AND BENEFITS

Ultrafast switching

■

Low forward voltage drop

■

Low thermal resistance

■

Low leakage current (platinium doping)

DESCRIPTION

The STTH3L06, which is using ST Turbo 2 600V

technology, is specially suited as boost diode in

discontinuous or critical mode power factor correc-

tions.

This device is intended for use as a free wheeling

diode in power supplies and other power switching

applications.

Table 2: Order Codes

Part Number

STTH3L06

STTH3L06RL

STTH3L06B

STTH3L06B-TR

STTH3L06U

STTH3L06S

September 2005

3 A

600 V

100 µA

175°C

0.85 V

60 ns

Marking

STTH3L06

STTH3L06B

3L6U

S06

REV. 3

STTH3L06

DO-201AD

DPAK

STTH3L06

STTH3L06B

SMB

SMC

STTH3L06U

STTH3L06S

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STTH3L06 Summary of contents
Page 1 ... Low thermal resistance ■ Low leakage current (platinium doping) DESCRIPTION The STTH3L06, which is using ST Turbo 2 600V technology, is specially suited as boost diode in discontinuous or critical mode power factor correc- tions. This device is intended for use as a free wheeling diode in power supplies and other power switching applications ... Page 2 ... STTH3L06 Table 3: Absolute Ratings (limiting values) Symbol V Repetitive peak reverse voltage RRM I RMS forward current F(RMS) I Average forward current F(AV) δ = 0.5 I Surge non repetitive forward current FSM T Storage temperature range stg T Maximum operating junction temperature j Table 4: Thermal Parameters Symbol R Junction to lead ... Page 3 ... FM 0.5 1.0 1.5 2.0 2.5 /dt (typical values F(AV F(AV F(AV) I =0. F(AV) dI /dt(A/µ 100 150 200 250 300 350 F(AV F(AV F(AV) dI /dt(A/µ 100 120 140 STTH3L06 3.0 3.5 400 450 500 / F 160 180 200 3/10 ... Page 4 ... STTH3L06 Figure 7: Softness factor versus d values) S factor 2 F(AV) 1.8 V =400V R T =125°C j 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 dI /dt(A/µ 100 120 Figure 9: Transient peak forward voltage versus dI /dt (typical values ( F(AV =125° /dt(A/µ 100 ... Page 5 ... Figure 15: Thermal resistance versus lead length R (°C/W) th 100 th(j- th(j- (mm) lead Figure 14: Thermal resistance junction to ambient versus copper surface under tab (epoxy FR4 (°C/W) th(j-a) 100 3.5 4.0 4.5 5 DO-201AD 20 25 STTH3L06 =35µm) (DPAK) CU DPAK S (cm² 5/10 ... Page 6 ... STTH3L06 Figure 16: DPAK Package Mechanical Data Figure 17: DPAK Foot Print Dimensions (in millimeters) 6.7 1.6 2.3 2.3 6/10 REF 6 1.6 DIMENSIONS Millimeters Inches Min. Max Min. 2.20 2.40 0.086 0.90 1.10 0.035 0.03 0.23 0.001 0.64 0.90 0.025 5.20 5.40 0.204 0.45 ... Page 7 ... Figure 18: SMB Package Mechanical Data Figure 19: SMB Foot Print Dimensions (in millimeters) 1.52 2.75 REF 2.3 1.52 STTH3L06 DIMENSIONS Millimeters Inches Min. Max. Min. 1.90 2.45 0.075 0.05 0.20 0.002 1.95 2.20 0.077 0.15 0.41 0.006 5.10 5.60 0.201 4.05 4.60 0.159 3 ... Page 8 ... STTH3L06 Figure 20: SMC Package Mechanical Data Figure 21: SMC Foot Print Dimensions (in millimeters) 2.0 4.2 8/10 REF 3.3 2.0 DIMENSIONS Millimeters Inches Min. Max. Min. 1.90 2.45 0.075 0.05 0.20 0.002 2.90 3.2 0.114 0.15 0.41 0.006 7.75 8.15 0.305 6.60 7.15 ... Page 9 ... Package DO-201AD DO-201AD DPAK DPAK 3L6U SMB S06 SMC 1 First issue 2 SMB, SMC and DPAK packages added 3 Changed marking of STTH3L06U from 3L06U to 3L6U. Added ECOPACK statement DIMENSIONS Millimeters Inches Min. Max. Min. 9.50 25.40 1.000 5.30 1.30 1. The lead diameter ø not controlled over zone E ... Page 10 ... STTH3L06 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice ...

STTH3L06 Summary of contents

Page 1
... Low thermal resistance ■ Low leakage current (platinium doping) DESCRIPTION The STTH3L06, which is using ST Turbo 2 600V technology, is specially suited as boost diode in discontinuous or critical mode power factor correc- tions. This device is intended for use as a free wheeling diode in power supplies and other power switching applications ...
Page 2
... STTH3L06 Table 3: Absolute Ratings (limiting values) Symbol V Repetitive peak reverse voltage RRM I RMS forward current F(RMS) I Average forward current F(AV) δ = 0.5 I Surge non repetitive forward current FSM T Storage temperature range stg T Maximum operating junction temperature j Table 4: Thermal Parameters Symbol R Junction to lead ...
Page 3
... FM 0.5 1.0 1.5 2.0 2.5 /dt (typical values F(AV F(AV F(AV) I =0. F(AV) dI /dt(A/µ 100 150 200 250 300 350 F(AV F(AV F(AV) dI /dt(A/µ 100 120 140 STTH3L06 3.0 3.5 400 450 500 / F 160 180 200 3/10 ...
Page 4
... STTH3L06 Figure 7: Softness factor versus d values) S factor 2 F(AV) 1.8 V =400V R T =125°C j 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 dI /dt(A/µ 100 120 Figure 9: Transient peak forward voltage versus dI /dt (typical values ( F(AV =125° /dt(A/µ 100 ...
Page 5
... Figure 15: Thermal resistance versus lead length R (°C/W) th 100 th(j- th(j- (mm) lead Figure 14: Thermal resistance junction to ambient versus copper surface under tab (epoxy FR4 (°C/W) th(j-a) 100 3.5 4.0 4.5 5 DO-201AD 20 25 STTH3L06 =35µm) (DPAK) CU DPAK S (cm² 5/10 ...
Page 6
... STTH3L06 Figure 16: DPAK Package Mechanical Data Figure 17: DPAK Foot Print Dimensions (in millimeters) 6.7 1.6 2.3 2.3 6/10 REF 6 1.6 DIMENSIONS Millimeters Inches Min. Max Min. 2.20 2.40 0.086 0.90 1.10 0.035 0.03 0.23 0.001 0.64 0.90 0.025 5.20 5.40 0.204 0.45 ...
Page 7
... Figure 18: SMB Package Mechanical Data Figure 19: SMB Foot Print Dimensions (in millimeters) 1.52 2.75 REF 2.3 1.52 STTH3L06 DIMENSIONS Millimeters Inches Min. Max. Min. 1.90 2.45 0.075 0.05 0.20 0.002 1.95 2.20 0.077 0.15 0.41 0.006 5.10 5.60 0.201 4.05 4.60 0.159 3 ...
Page 8
... STTH3L06 Figure 20: SMC Package Mechanical Data Figure 21: SMC Foot Print Dimensions (in millimeters) 2.0 4.2 8/10 REF 3.3 2.0 DIMENSIONS Millimeters Inches Min. Max. Min. 1.90 2.45 0.075 0.05 0.20 0.002 2.90 3.2 0.114 0.15 0.41 0.006 7.75 8.15 0.305 6.60 7.15 ...
Page 9
... Package DO-201AD DO-201AD DPAK DPAK 3L6U SMB S06 SMC 1 First issue 2 SMB, SMC and DPAK packages added 3 Changed marking of STTH3L06U from 3L06U to 3L6U. Added ECOPACK statement DIMENSIONS Millimeters Inches Min. Max. Min. 9.50 25.40 1.000 5.30 1.30 1. The lead diameter ø not controlled over zone E ...
Page 10
... STTH3L06 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice ...

STTH3L06

STTH3L06

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Specifications of STTH3L06

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STTH3L06 Summary of contents

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