STPS10L25G-TR STMicroelectronics, STPS10L25G-TR Datasheet
STPS10L25G-TR
Specifications of STPS10L25G-TR
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STPS10L25G-TR Summary of contents
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... Rth July 2003 - 150 °C 0. REVERSE TO-220AC STPS10L25D Parameter Tc = 140° Sinusoidal tp=2 µs square F=1kHz tp = 100 µs square tp = 1µ 25°C STPS10L25D PAK STPS10L25G Value 0.5 10 200 1 3 5500 - 150 150 10000 A Unit °C V/µs 1/5 ...
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STPS10L25D/G THERMAL RESISTANCE Symbol R Junction to case th (j-c) STATIC ELECTRICAL CHARACTERISTICS Symbol Tests Conditions I * Reverse leakage current Forward voltage drop F Pulse test 380 µs, < evaluate the ...
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... Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(nF) 5.0 1.0 0 Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness : 35 µm). (STPS10L25G only) Rth(j-a) (°C/ STPS10L25D/G = 0.5 = 0.2 = 0.1 ...
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STPS10L25D/G PACKAGE MECHANICAL DATA 2 D PAK FLAT ZONE NO LESS THAN 2mm FOOT PRINT DIMENSIONS (in millimeters) 16.90 10.30 8.90 4/5 REF ...
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... Marking STPS10L25D STPS10L25D STPS10L25G STPS10L25G STPS10L25G-TR STPS10L25G Epoxy meets UL94,V0 n Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics ...