RHRG30120 Fairchild Semiconductor, RHRG30120 Datasheet
RHRG30120
Manufacturer Part Number
RHRG30120
Description
DIODE HYPER 1200V 30A TO247
Manufacturer
Fairchild Semiconductor
Datasheet
1.RHRG30120.pdf
(4 pages)
Specifications of RHRG30120
Voltage - Forward (vf) (max) @ If
3.2V @ 30A
Voltage - Dc Reverse (vr) (max)
1200V (1.2kV)
Current - Average Rectified (io)
30A
Current - Reverse Leakage @ Vr
250µA @ 1200V
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
85ns
Mounting Type
Through Hole, Radial
Package / Case
TO-247-2
Product
Ultra Fast Recovery Rectifier
Configuration
Single
Reverse Voltage
1200 V
Forward Voltage Drop
3.2 V
Recovery Time
85 ns
Forward Continuous Current
30 A
Max Surge Current
300 A
Reverse Current Ir
250 uA
Power Dissipation
125 W
Mounting Style
Through Hole
Maximum Operating Temperature
+ 175 C
Minimum Operating Temperature
- 65 C
Rectifier Type
Switching Diode
Peak Rep Rev Volt
1200V
Avg. Forward Curr (max)
30A
Rev Curr
250uA
Peak Non-repetitive Surge Current (max)
300A
Forward Voltage
3.2V
Operating Temp Range
-65C to 175C
Package Type
TO-247
Rev Recov Time
85ns
Operating Temperature Classification
Military
Mounting
Through Hole
Pin Count
2 +Tab
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Capacitance @ Vr, F
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
RHRG30120
Manufacturer:
HARRIS
Quantity:
100
Company:
Part Number:
RHRG30120
Manufacturer:
TOSHIBA
Quantity:
4 000
Part Number:
RHRG30120
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
Part Number:
RHRG30120CC
Manufacturer:
infineon
Quantity:
20
Company:
Part Number:
RHRG30120CC
Manufacturer:
Intersil/FSC
Quantity:
12 500
Part Number:
RHRG30120CC
Manufacturer:
HARRIS
Quantity:
20 000
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence. This is a preliminary
notification. A Final PCN will be issued when qualification is complete and data is available.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Sun, Brian
E-mail: Brian.Sun@fairchildsemi.com
Phone:
Implementation of change:
Expected 1st Device Shipment Date: 2008/03/20
Earliest Year/Work Week of Changed Product: 0812
Change Type Description: Lead Frame Composition
Description of Change (From): The material composition of lead frame is bare copper with full
Ni-plating
Description of Change (To): The material composition of lead frame is bare copper without
Ni-plating. lead frame Plating method change from Option 2(full nickle plating) to Option 1(
bare copper). Refer to attached lead frame drawing. There is no change in package dimension,
process and electrical specification.
Reason for Change : Quality improvement to enhance the adhesion strength between EMC and
lead frame
Qual/REL Plan Numbers : Q20070460
Qualification :
To qualify TO247 bare copper leadframe, improve quality to enhance the adhesion
strength between EMC and lead frame, to prevent moisture enter into package
Change To
Technical Contact:
Name: LEE, SANGDO
E-mail: SANGDO.LEE@fairchildsemi.com
Phone: 86-512-6762-3311 ext 8671
FORECAST CHANGE NOTIFICATION
Date Issued On : 2007/12/20
Date Created : 2007/11/30
PCN# : Q4074814
Pg. 1
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RHRG30120 Summary of contents
Page 1
... This notification is for your information and concurrence. This is a preliminary notification. A Final PCN will be issued when qualification is complete and data is available. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. If you have any questions concerning this change, please contact: ...
Page 2
Qualification Stress Test and Sample Size Detail Device #1 FGH50N6S2D Package: #Leads: Environment Stress Detail: Stress P/C Standard ACLV JESD22-A102 100%RH, 121C 96 PRCL MIL- STD-750-1036 TMCL1 JESD22-A104 -65C, 150C Device #2 HGTG27N120BN Package: #Leads: Environment Stress Detail: Stress P/C ...
Page 3
STD-750-1036 Min on/off TMCL1 JESD22-A104 -65C, 150C Device #4 HUF75652G3 Package #Leads: Environment Stress Detail: Stress P/C Standard ACLV JESD22-A102 100%RH, 121C 96 PRCL MIL- STD-750-1036 TMCL1 JESD22-A104 -65C, 150C Device #5 ISL9K30120G3 Package: #Leads: Environment Stress Detail: ...
Page 4
... HGTG30N60C3D HGTG40N60C3_R4752 HGTG7N60A4D HUF75345G3 HUF75852G3 ISL9K30120G3 ISL9R18120G2 ISL9R3060G2 RHRG30120 RHRG5060 RURG3020CC RURG5060 RURG8060 HGTG40N60A4 HGTG5N120BND HUF75339G3 HUF75639G3 ISL9K1560G3 ISL9K3060G3 ISL9R2480G2_S2611 RFG70N06 RHRG3060 RHRG75120 RURG3060 RURG5060_R4857 HGTG40N60B3 HGTG7N60A4 HUF75344G3 HUF75652G3 ISL9K18120G3 ISL9R1560G2 ISL9R30120G2 RHRG1560CC RHRG3060CC RURG1520CC RURG3060CC RURG80100 Pg. 4 ...