BAS116H,115 NXP Semiconductors, BAS116H,115 Datasheet - Page 6

DIODE SWITCH 75V 215MA SOD-123

BAS116H,115

Manufacturer Part Number
BAS116H,115
Description
DIODE SWITCH 75V 215MA SOD-123
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAS116H,115

Package / Case
SOD-123 Flat Leads
Voltage - Forward (vf) (max) @ If
1.25V @ 150mA
Voltage - Dc Reverse (vr) (max)
75V
Current - Average Rectified (io)
215mA (DC)
Current - Reverse Leakage @ Vr
5nA @ 75V
Diode Type
Standard
Speed
Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr)
3µs
Capacitance @ Vr, F
2pF @ 0V, 1MHz
Mounting Type
Surface Mount
Product
Switching Diodes
Peak Reverse Voltage
75 V
Forward Continuous Current
0.215 A
Max Surge Current
4 A
Configuration
Single
Recovery Time
3 ns
Forward Voltage Drop
1.25 V
Maximum Reverse Leakage Current
5 uA
Operating Temperature Range
+ 150 C
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
934059308115
BAS116H T/R
BAS116H T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAS116H,115
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
NXP Semiconductors
9. Package outline
10. Packing information
Table 8.
The -xxx numbers are the last three digits of the 12NC ordering code.
[1]
11. Soldering
BAS116H_2
Product data sheet
Type number
BAS116H
For further information and the availability of packing methods, see
Packing methods
Package
SO123F
Fig 6.
Fig 7.
2.1
Description
4 mm pitch, 8 mm tape and reel
Package outline SOD123F
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering footprint SOD123F
1.6
(2×)
1.1
Rev. 02 — 14 December 2009
Dimensions in mm
3.6
3.4
2.7
2.5
4.4
2.9
1.6
4
75 V, low leakage diode in small SOD123F package
Section
0.70
0.55
1.7
1.5
[1]
14.
1
2
1.1 1.2
0.55
0.35
-115
Packing quantity
3000
1.2
1.0
0.25
0.10
04-11-29
BAS116H
© NXP B.V. 2010. All rights reserved.
solder lands
solder resist
solder paste
occupied area
-135
10000
6 of 9

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