CLS03(TE16L,Q) Toshiba, CLS03(TE16L,Q) Datasheet

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CLS03(TE16L,Q)

Manufacturer Part Number
CLS03(TE16L,Q)
Description
DIODE SCHOTTKY 60V 10A L-FLAT
Manufacturer
Toshiba
Datasheet

Specifications of CLS03(TE16L,Q)

Voltage - Forward (vf) (max) @ If
580mV @ 10A
Voltage - Dc Reverse (vr) (max)
60V
Current - Average Rectified (io)
10A
Current - Reverse Leakage @ Vr
1mA @ 60V
Diode Type
Schottky
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type
Surface Mount
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Capacitance @ Vr, F
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CLS03(TE16L,Q)
Manufacturer:
ROHM
Quantity:
120
Part Number:
CLS03(TE16L,Q)
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Switching-Mode Power Supply (Secondary-Rectification)
Applications (Low Voltage)
DC/DC Converter Applications
Absolute Maximum Ratings
Electrical Characteristics
Forward voltage: V
Average forward current: I
Repetitive peak reverse voltage: V
Suitable for compact assembly due to small surface-mount package:
“L−FLAT
Repetitive peak reverse voltage
Average forward current
Non-repetitive peak surge current
Junction temperature
Storage temperature range
Note 1: Tℓ = 70°C
Note 2: Using continuously under heavy loads (e.g. the application of
Peak forward voltage
Peak repetitive reverse current
Junction capacitance
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to lead)
Rectangular waveform (α = 180°), V
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
TM
Characteristics
Characteristics
” (Toshiba package name)
FM
= 0.58 V (max)
F (AV)
(Ta = 25°C)
= 10 A
RRM
(Ta = 25°C)
TOSHIBA Schottky Barrier Diode
Symbol
Symbol
I
I
V
V
V
R
RRM (1)
RRM (2)
R
I
V
F (AV)
I
FM (1)
FM (2)
FM (3)
T
th (j-a)
FSM
th (j-ℓ)
RRM
C
T
= 60 V
stg
j
j
R
CLS03
= 30 V
I
I
I
V
V
V
Device mounted on a glass-epoxy
board
(board size: 50 mm × 50 mm)
(board thickness: 1.6 t)
(soldering land)
FM
FM
FM
RRM
RRM
R
100 (50 Hz)
Cathode 5.7 mm × 6.2 mm
Anode
−40~125
−40~150
= 10 V, f = 1.0 MHz
= 3.0 A (pulse test)
= 5.0 A (pulse test)
= 10 A (pulse test)
Rating
10 (Note 1)
= 5 V (pulse test)
= 60 V (pulse test)
60
1
Test Condition
4.5 mm × 3.4 mm
Unit
°C
°C
V
A
A
Weight: 0.15 g (typ.)
JEDEC
JEITA
TOSHIBA
Min
Typ.
0.36
0.41
0.53
345
7.0
0.1
3-4F1A
2006-11-13
Max
0.58
① ANODE
① アノード
② カソード
② CATHODE
100
1.0
5
CLS03
Unit: mm
°C/W
°C/W
Unit
mA
μA
pF
V

Related parts for CLS03(TE16L,Q)

CLS03(TE16L,Q) Summary of contents

Page 1

... Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc) ...

Page 2

Marking Abbreviation Code Part No. S03 CLS03 Standard Soldering Pad 1.8 2.6 Handling Precautions 1) Schottky barrier diodes have reverse current characteristics compared to other diodes. There is a possibility that SBD will cause thermal runaway when used under high-temperature ...

Page 3

F F 100 125°C 10 75°C 1 25°C 0.1 Pulse test 0.01 0.0 0.2 0.4 0.6 0.8 Instantaneous forward voltage v F Tℓ max – (AV) 140 120 100 80 α = ...

Page 4

C – 10000 5000 1000 500 100 Reverse voltage V ( – 1000 Pulse test 100 0.1 ...

Page 5

... Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ...

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