M1MA174T1G ON Semiconductor, M1MA174T1G Datasheet

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M1MA174T1G

Manufacturer Part Number
M1MA174T1G
Description
DIODE SW SS 200MA 100V SOT-323
Manufacturer
ON Semiconductor
Datasheet
1.M1MA174T1.pdf (8 pages)

Specifications of M1MA174T1G

Voltage - Forward (vf) (max) @ If
1V @ 10mA
Voltage - Dc Reverse (vr) (max)
100V
Current - Average Rectified (io)
200mA (DC)
Current - Reverse Leakage @ Vr
5µA @ 75V
Diode Type
Standard
Speed
Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr)
4ns
Capacitance @ Vr, F
4pF @ 0V, 1MHz
Mounting Type
Surface Mount
Package / Case
SC-70-3, SOT-323-3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
MAXIMUM RATINGS
November, 2001 – Rev. 1
THERMAL CHARACTERISTICS
ELECTRICAL CHARACTERISTICS
Continuous Reverse Voltage
Recurrent Peak Forward Current
Peak Forward Surge Current
Pulse Width = 10 s
Total Power Dissipation,
T A = 25 C
Derate above 25 C
Mounted on a Ceramic Substrate
(10 x 8 x 0.6 mm)
Operating and Storage Junction
Thermal Resistance,
One Diode Loaded
Mounted on a Ceramic Substrate
(10 x 8 x 0.6 mm)
Reverse Breakdown Voltage
Reverse Voltage Leakage Current
Diode Capacitance
Forward Voltage
Reverse Recovery Time
Semiconductor Components Industries, LLC, 2001
One Diode Loaded
Temperature Range
Junction to Ambient
(I R = 100 Adc)
(V R = 20 Vdc)
(V R = 75 Vdc)
(V R = 0, f = 1.0 MHz)
(I F = 10 mAdc)
(I F = I R = 10 mAdc) (Figure 1)
Characteristic
Characteristic
Rating
Preferred Device
I FM(surge)
Symbol
Symbol
T J , T stg
Symbol
(T A = 25 C unless otherwise noted)
V (BR)
R JA
C T
V F
V R
P D
I R
t rr
I F
Min
100
–
–
–
–
–
–55 to
Value
0.625
+150
Max
100
200
500
200
1.6
Max
5.0
4.0
1.0
4.0
25
–
mW/ C
1
C/mW
Unit
Unit
mW
mA
mA
nAdc
Unit
V
Vdc
Vdc
C
pF
Adc
ns
Preferred devices are recommended choices for future use
and best overall value.
M1MA174T1
Device
ORDERING INFORMATION
MARKING DIAGRAM
http://onsemi.com
J6 = Device Code
M
SC–70/SOT–323
Package
1
SC–70
CASE 419
= Date Code
STYLE 2
J6 M
2
Publication Order Number:
3
3000/Tape & Reel
M1MA174T1/D
Shipping

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M1MA174T1G Summary of contents

Page 1

Preferred Device MAXIMUM RATINGS Rating Continuous Reverse Voltage Recurrent Peak Forward Current Peak Forward Surge Current Pulse Width = 10 s Total Power Dissipation, One Diode Loaded Derate above 25 C Mounted on a Ceramic ...

Page 2

M1MA174T1 Notes 2.0 k variable resistor adjusted for a Forward Current ( mA. Notes: 2. Input pulse is adjusted so I R(peak) is equal to 10 mA. Notes » ...

Page 3

INFORMATION FOR USING THE SC–70/SOT–323 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure ...

Page 4

Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of ...

Page 5

M1MA174T1 PACKAGE DIMENSIONS SC–70 (SOT–323) CASE 419–04 ISSUE http://onsemi.com ...

Page 6

Notes M1MA174T1 http://onsemi.com 6 ...

Page 7

Notes M1MA174T1 http://onsemi.com 7 ...

Page 8

... Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800–282–9855 Toll Free USA/Canada M1MA174T1 JAPAN: ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031 Phone: 81–3–5740–2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi ...

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