IGBT HS W/DIODE 600V 48A TO268

 

IXST30N60B2D1

Manufacturer Part NumberIXST30N60B2D1
DescriptionIGBT HS W/DIODE 600V 48A TO268
ManufacturerIXYS
IXST30N60B2D1 datasheets

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Specifications of IXST30N60B2D1

Igbt TypePTVoltage - Collector Emitter Breakdown (max)600V
Vce(on) (max) @ Vge, Ic2.5V @ 15V, 24ACurrent - Collector (ic) (max)48A
Power - Max250WInput TypeStandard
Mounting TypeSurface MountPackage / CaseTO-268
Channel TypeNConfigurationSingle
Collector-emitter Voltage600VCollector Current (dc) (max)48A
Gate To Emitter Voltage (max)±20VPackage TypeTO-268
Pin Count3 +TabMountingThrough Hole
Operating Temperature (min)-55Operating Temperature (max)150C
Operating Temperature ClassificationMilitaryVces, (v)600
Ic25, Tc=25°c, Igbt, (a)48Ic90, Tc=90°c, Igbt, (a)-
Vce(sat), Max, Tj=25°c, Igbt, (v)2.5Tfi, Typ, Igbt, (ns)140
Eoff, Typ, Tj=125°c, Igbt, (mj)1.18Rthjc, Max, Igbt, (k/w)0.5
Package StyleTO-268Lead Free Status / RoHS StatusLead free / RoHS Compliant
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High Speed IGBT
with Diode
Short Circuit SOA Capability
Preliminary Data Sheet
Symbol
Test Conditions
V
T
= 25°C to 150°C
CES
J
V
T
= 25°C to 150°C; R
CGR
J
V
Continuous
GES
V
Transient
GEM
I
T
= 25°C
C25
C
I
T
= 110°C
C110
C
I
F(110)
I
T
= 25°C, 1 ms
CM
C
SSOA
V
= 15 V, T
= 125°C, R
GE
J
(RBSOA)
Clamped inductive load
t
V
= 15 V, V
= 360 V, T
SC
GE
CE
(SCSOA)
R
= 10 Ω, non repetitive
G
P
T
= 25°C
C
C
T
J
T
JM
T
stg
Weight
TO-247
TO-268
Maximum lead temperature for soldering
1.6 mm (0.062 in.) from case for 10 s
Maximum tab temperature for soldering for 10s
Symbol
Test Conditions
= 750 µA, V
V
I
= V
GE(th)
C
CE
I
V
= V
CES
CE
CES
V
= 0 V
GE
I
V
= 0 V, V
= ± 20 V
GES
CE
GE
V
I
= 24A, V
= 15 V
CE(sat)
C
GE
© 2004 IXYS All rights reserved
IXSH 30N60B2D1
IXST 30N60B2D1
Maximum Ratings
600
= 1 MΩ
600
GE
± 20
± 30
48
30
28
90
= 10Ω
I
= 48
G
CM
@ 0.8 V
CES
= 125°C
10
J
250
-55 ... +150
150
-55 ... +150
6
5
300
260
Characteristic Values
(T
= 25°C, unless otherwise specified)
J
min.
typ.
max.
4.0
GE
± 100
V
CES
I
C25
V
CE(sat)
TO-247 (IXSH)
V
V
V
V
G
C
E
A
A
A
TO-268 (IXST)
A
A
G
E
µs
W
G = Gate
C = Collector
E = Emitter
TAB = Collector
°C
°C
Features
°C
• International standard package
g
• Guaranteed Short Circuit SOA
g
capability
• Low V
°C
CE(sat)
- for low on-state conduction losses
• High current handling capability
°C
• MOS Gate turn-on
- drive simplicity
• Fast fall time for switching speeds
up to 20 kHz
Applications
• AC motor speed control
• Uninterruptible power supplies (UPS)
• Welding
7.0
V
Advantages
150
µA
• High power density
1
mA
nA
2.5
V
= 600 V
= 48 A
= 2.5 V
C (TAB)
C (TAB)
DS99249(10/04)

IXST30N60B2D1 Summary of contents

  • Page 1

    ... Test Conditions = 750 µ GE(th CES CE CES ± GES 24A CE(sat © 2004 IXYS All rights reserved IXSH 30N60B2D1 IXST 30N60B2D1 Maximum Ratings 600 = 1 MΩ 600 GE ± 20 ± 10Ω 0.8 V CES = 125° 250 -55 ... +150 150 -55 ... +150 6 5 300 260 ...

  • Page 2

    ... V = 100 -di/dt = 100 A/µ thJC Note 1: Pulse test, t ≤ 300 µs, duty cycle d ≤ IXYS MOSFETs and IGBTs are covered by 4,835,592 one or moreof the following U.S. patents: 4,850,072 4,881,106 Characteristic Values (T = 25°C, unless otherwise specified) J min. typ. 7.0 12.0 1220 ...

  • Page 3

    Fig. 1. Output Characteristics º 17V 0.5 1 1 Volts C E Fig. 3. Output Characteristics º @ 125 ...

  • Page 4

    Fig. 7. Transconductance º - º º 125 Amperes C Fig. 9. Dependence of Turn-Off Energy ...

  • Page 5

    Fig. 13. Dependence of Turn-off Sw itching Tim e on Tem perature 260 t d(off) 240 48A fi C 24A R = 5Ω G 220 12A V = 15V GE 200 ...

  • Page 6

    =150° =100° =25° Fig. 18. Forward current I versus V F 2.0 1 1.0 I ...