MMBFJ175LT1G ON Semiconductor, MMBFJ175LT1G Datasheet

MMBFJ175LT1G

Manufacturer Part Number

MMBFJ175LT1G

Description

JFET SS P-CHAN 25V SOT23

Manufacturer

ON Semiconductor

Datasheet

1.MMBFJ175LT1.pdf (2 pages)

Specifications of MMBFJ175LT1G

Current - Drain (idss) @ Vds (vgs=0)

7mA @ 15V

Fet Type

P-Channel

Voltage - Breakdown (v(br)gss)

30V

Voltage - Cutoff (vgs Off) @ Id

3V @ 10nA

Input Capacitance (ciss) @ Vds

11pF @ 10V (VGS)

Resistance - Rds(on)

125 Ohm

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Power - Max

225mW

Configuration

Single

Transistor Polarity

P-Channel

Gate-source Breakdown Voltage

- 25 V

Drain Current (idss At Vgs=0)

7 mA to 60 mA

Maximum Operating Temperature

+ 150 C

Maximum Drain Gate Voltage

25 V

Minimum Operating Temperature

- 55 C

Mounting Style

SMD/SMT

Capacitance, Input

11 pF

Capacitance, Reverse Recovery

5.5 pF

Channel Type

P-Channel

Current, Drain

60 mA

Current, Drain Cutoff

1 nA

Current, Drain, Saturation

60 mA

Current, Gate Reverse

1 nA

Package Type

SOT-23 (TO-236)

Polarization

P-Channel

Power Dissipation

225 mW

Resistance, Drain To Source On

125 Ohms

Resistance, On

125 Ohms

Temperature, Operating, Maximum

+150 °C

Temperature, Operating, Minimum

–55 °C

Transistor Type

P-Channel

Voltage, Breakdown, Gate To Source

–30 V

Voltage, Gate To Source, Breakdown

–25 V

Voltage, Gate To Source, Cut-off

6 V

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

MMBFJ175LT1GOS
MMBFJ175LT1GOS
MMBFJ175LT1GOSTR

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

MMBFJ175LT1G

Manufacturer:

Quantity:

30 000

Company:

Meier Automation Equipment Co., Limited

Part Number:

MMBFJ175LT1G

Manufacturer:

ON/安森美

Quantity:

20 000

Company:

Amily Shenzhen XNWY Technology Co., Ltd

Part Number:

MMBFJ175LT1G

Company:

H&T Electronics

Part Number:

MMBFJ175LT1G

Quantity:

9 000

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MMBFJ175LT1G

JFET Chopper

P−Channel − Depletion

Features

•

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−5 = 1.0 x 0.75 x 0.062 in.

2. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.

August, 2009 − Rev. 5

MAXIMUM RATINGS

THERMAL CHARACTERISTICS

ELECTRICAL CHARACTERISTICS

OFF CHARACTERISTICS

ON CHARACTERISTICS

Drain−Gate Voltage

Reverse Gate−Source Voltage

Total Device Dissipation FR−5 Board,

Thermal Resistance, Junction−to−Ambient

Junction and Storage Temperature

Gate −Source Breakdown Voltage

Gate Reverse Current

Gate −Source Cutoff Voltage

Zero Gate−Voltage Drain Current (Note 2)

Drain Cutoff Current

Drain Source On Resistance

Input Capacitance

Reverse Transfer

Capacitance

Compliant

These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

(Note 1) T

Derate above 25°C

= 500 mA)

= 0, I

= 0 V, V

= 15, I

= 15 V, V

= 0, V

Characteristic

= 1.0 mA)

= 25°C

Rating

= 10 nA)

= 15 V)

= 20 V)

= 10 V)

f = 1.0 MHz

= 0, V

= 10V

Symbol

= 25°C unless otherwise noted)

Symbol

(BR)GSS

GS(OFF)

DS(on)

D(off)

GSS

DSS

GS(r)

, T

rss

qJA

iss

stg

−55 to +150

Min

3.0

7.0

−

Value

Max

−25

225

556

1.8

Max

125

1.0

6.0

1.0

5.5

−

mW/°C

°C/W

Unit

°C

†For information on tape and reel specifications,

MMBFJ175LT1G

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

*Date Code orientation and/or overbar may

Device

vary depending upon manufacturing location.

(Note: Microdot may be in either location)

ORDERING INFORMATION

GATE

MARKING DIAGRAM

http://onsemi.com

= Device Code

= Date Code*

= Pb−Free Package

(Pb−Free)

Package

SOT−23

6W M G

Publication Order Number:

SOT−23 (TO−236)

1 DRAIN

2 SOURCE

CASE 318

STYLE 10

3000 / Tape & Reel

MMBFJ175LT1/D

Shipping

†

Related parts for MMBFJ175LT1G

MMBFJ175LT1G Summary of contents

Page 1

... Code orientation and/or overbar may vary depending upon manufacturing location. ORDERING INFORMATION Device Package Shipping MMBFJ175LT1G SOT−23 3000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D ...

Page 2

... A A1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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