FDY3000NZ Fairchild Semiconductor, FDY3000NZ Datasheet
FDY3000NZ
Specifications of FDY3000NZ
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FDY3000NZ Summary of contents
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... Thermal anc e, Junc Ambi Thermal anc e, Junc Ambi Package Mar ki ng and Or der Dev i ce Mar ki ng Dev FDY3000NZ 2007 Fai Semi c onduc t or Corporat i on FDY3000NZ Rev B Feat ur es 600 mA ESD prot ode ( not e 3) RoHS Compl i ant ...
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... Q Diode Reverse Recovery Charge rr Notes the sum of the j unction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of JA the drain pins guaranteed by design while FDY3000NZ Rev 25° C unless otherwise noted A Test Conditions 250 250 A, Referenced ...
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... Figure 3. On-Resistance Variation with Temperature 0.8 0.6 0 125 C A 0.2 -55 0 0 GATE TO SOURCE VOLTAGE (V) GS Figure 5. Transfer Characteristics. FDY3000NZ Rev B 2.6 2 2.0V GS 2.2 2.0V 2 1.8 1.6 1.4 1.2 1 0.8 0 0.75 1 Figure 2. On-Resistance Variation with Drain Current and Gate Voltage. 1 0.9 0.8 0.7 ...
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... D = 0.5 0.2 0.1 0.1 0.05 0.02 0.01 SINGLE PULSE 0.01 0.0001 0.001 Figure 11. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design. FDY3000NZ Rev B 100 10V 15V rss 0 0 ...
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... Dimensional Outline and Pad Layout 1.70 1.50 6 1.20 BSC 1 (0.20) 0.20 BSC FDY3000NZ Rev B 0.30 0.50 0.15 4 1.70 1.25 1.55 3 0.30 0.50 LAND PATTERN RECOMMENDATION 1.00 0.60 SEE DETAIL A 0.56 0.35 BSC 0.10 0.00 NOTES: UNLESS OTHERWISE SPECIFIED A) THIS PACKAGE CONFORMS TO EIAJ SC89 PACKAGING STANDARD ...
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TRADEMARKS The following are registered and unregistered tradem ark s F airc hild onduc tor owns or is authoriz ed to use and is not intended haustiv e list of all suc ...