FDC6327C | |
|---|---|
| Manufacturer Part Number | FDC6327C |
| Description | MOSFET N/P-CH DUAL 20V SSOT-6 |
| Manufacturer | Fairchild Semiconductor |
| Series | PowerTrench® |
| FDC6327C datasheets |
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| Product Change Notification |
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Availability: In stock
International delivery:
Warranty: 60 days
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- We provide standard 60-days warranty for all parts. If warranty differs we always mention it beforehand. In case of return we cover shipping costs.
- If you still have any questions - please contact us
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Specifications of FDC6327C | |||
|---|---|---|---|
| Fet Type | N and P-Channel | Fet Feature | Logic Level Gate |
| Rds On (max) @ Id, Vgs | 80 mOhm @ 2.7A, 4.5V | Drain To Source Voltage (vdss) | 20V |
| Current - Continuous Drain (id) @ 25° C | 2.7A, 1.9A | Vgs(th) (max) @ Id | 1.5V @ 250µA |
| Gate Charge (qg) @ Vgs | 4.5nC @ 4.5V | Input Capacitance (ciss) @ Vds | 325pF @ 10V |
| Power - Max | 700mW | Mounting Type | Surface Mount |
| Package / Case | 6-SSOT, SuperSOT-6 | Configuration | Dual |
| Transistor Polarity | N and P-Channel | Resistance Drain-source Rds (on) | 0.08 Ohm @ 4.5 V @ N Channel |
| Forward Transconductance Gfs (max / Min) | 7.7 S, 4.5 S | Drain-source Breakdown Voltage | 20 V |
| Gate-source Breakdown Voltage | +/- 8 V | Continuous Drain Current | 2.7 A @ N Channel or 1.9 A @ P Channel |
| Power Dissipation | 960 mW | Maximum Operating Temperature | + 150 C |
| Mounting Style | SMD/SMT | Minimum Operating Temperature | - 55 C |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | Other names | FDC6327C FDC6327CTR |
MMBFJ108_PRODUCT_CHANGE PDF datasheetMMBFJ108_PRODUCT_CHANGE PDF datasheet #2FDC6327C PDF datasheet #3
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FORECAST CHANGE NOTIFICATION
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence. This is a preliminary
notification. A Final PCN will be issued when qualification is complete and data is available.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
If you have any questions concerning this change, please contact:
Technical Contact:
Name: Uy, Lester
E-mail: Lester.Uy@fairchildsemi.com
Phone: 63-32-3415636
PCN Originator:
Name: Ursal, Randy
E-mail: Randy.Ursal@notes.fairchildsemi.com
Phone:
Implementation of change:
Expected 1st Device Shipment Date: 2008/01/14
Earliest Year/Work Week of Changed Product: D0803
Change Type Description: Mold Compound
Description of Change (From): SSOT-3 and SSOT-6 package assembly in FSC approved
manufacturing locations using non-Green mold compound as shown in table 1:
Description of Change (To): SSOT-3 and SSOT-6 package assembly at all FSC approved
manufacturing locations using Green mold compound as shown in table 2:
Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is
dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level
interconnect lead-free and RoHS compliance. The referenced material changes have been made
to provide a "Full Green" (Halogen Free Flame Retardant) package. For additional details on the
corporate wide green initiative please visit our Web site at:
http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same
assembly facilities producing the current non-green products. Package outline drawings of the
affected products remain un-changed. Green products will be fully compliant to all published
data sheet specifications and will be interchangeable with current non-green product. Quality
and reliability will remain at the highest standards already demonstrated with Fairchild's
existing products.
Qual/REL Plan Numbers : Q20070473
Qualification :
Qualification of Green Molding compound for SSOT-3 and SSOT-6.
Change From
Date Created : 2007/11/29
Date Issued On : 2007/12/07
PCN# : Q4074811
Pg. 1
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FDC6327C Summary of contents |
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