SH8M70TB1 Rohm Semiconductor, SH8M70TB1 Datasheet

MOSFET N/P-CH 250V SOP8

SH8M70TB1

Manufacturer Part Number
SH8M70TB1
Description
MOSFET N/P-CH 250V SOP8
Manufacturer
Rohm Semiconductor
Datasheet

Specifications of SH8M70TB1

Fet Type
N and P-Channel
Fet Feature
Standard
Rds On (max) @ Id, Vgs
1.63 Ohm @ 1.5A, 10V
Drain To Source Voltage (vdss)
250V
Current - Continuous Drain (id) @ 25° C
3A, 2.5A
Vgs(th) (max) @ Id
4V @ 1mA
Gate Charge (qg) @ Vgs
5.2nC @ 10V
Input Capacitance (ciss) @ Vds
180pF @ 25V
Power - Max
2W
Mounting Type
Surface Mount
Package / Case
8-SOP
Transistor Polarity
N and P-Channel
Resistance Drain-source Rds (on)
1.25 Ohms
Forward Transconductance Gfs (max / Min)
0.75 S
Drain-source Breakdown Voltage
250 V
Continuous Drain Current
3 A
Power Dissipation
2 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
SH8M70TB1TR
10V Drive Nch+Pch MOSFET
Structure
Features
1) Low on-resistance.
2) Built-in G-S Protection Diode.
3) Small Surface Mount Package (SOP8).
Application
Power switching, DC / DC converter.
Packaging specifications
Absolute maximum ratings (Ta=25C)
∗1 Pw≤10μs, Duty cycle≤1%
∗2 MOUNTED ON A CERAMIC BOARD.
Drain-source voltage
Gate-source voltage
Drain current
Source current
(Body diode)
Total power dissipation
Channel temperature
Storage temperature
c
Type
SH8M70
www.rohm.com
Silicon N-channel / P-channel MOSFET
SH8M70
2010 ROHM Co., Ltd. All rights reserved.
Parameter
Package
Code
Basic ordering unit (pieces)
Continuous
Pulsed
Continuous
Pulsed
Taping
2500
TB
Symbol
V
V
Tstg
Tch
I
I
P
DSS
GSS
I
I
DP
SP
D
S
D
∗1
∗1
∗2
2.0(TOTAL) 1.4(ELEMENT)
N-ch
±3.0
250
±12
1.0
30
12
−55 to +150
Limits
150
−250
P-ch
±2.5
−1.0
−20
±10
−10
1/7
Unit
°C
°C
W
V
V
A
A
A
A
Dimensions (Unit : mm)
Inner circuit
∗A protection diode is included between the gate and
∗2
the source terminals to protect the diode against static
electricity when the product is in use. Use the protection
circuit when the fixed voltages are exceeded.
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
SOP8
(8)
(1)
∗1
(7)
(2)
∗2
(6)
(3)
∗1
(5)
(4)
Each lead has same dimensions
2010.06 - Rev.B
(1) Tr1 Source
(2) Tr1 Gate
(3) Tr2 Source
(4) Tr2 Gate
(5) Tr2 Drain
(6) Tr2 Drain
(7) Tr1 Drain
(8) Tr1 Drain
(1) (2) (3) (4)
(8) (7) (6) (5)

Related parts for SH8M70TB1

SH8M70TB1 Summary of contents

Page 1

Drive Nch+Pch MOSFET SH8M70 Structure Silicon N-channel / P-channel MOSFET Features 1) Low on-resistance. 2) Built-in G-S Protection Diode. 3) Small Surface Mount Package (SOP8). Application Power switching converter. Packaging specifications Package Taping Type Code TB ...

Page 2

SH8M70 N-ch Electrical characteristics (Ta=25C) Parameter Symbol Min. Gate-source leakage I GSS Drain-source breakdown voltage V 250 (BR) DSS Zero gate voltage drain current I DSS Gate threshold voltage V 2.0 GS (th) ∗ Static drain-source on-state R DS (on) ...

Page 3

SH8M70 P-ch Electrical characteristics (Ta=25C) Parameter Symbol Min. Gate-source leakage I GSS −250 Drain-source breakdown voltage V (BR) DSS Zero gate voltage drain current I DSS −2.0 Gate threshold voltage V GS (th) Static drain-source on-state ∗ (on) ...

Page 4

SH8M70 N-ch Electrical characteristic curves 1000 Ciss 100 Coss 10 f=1MHz V =0V GS Crss Ta=25°C Pulsed 1 0.01 0 100 1000 Drain-Source Voltage : V (V) DS Fig.1 Typical Capacitance vs. Drain-Source Voltage Ta=25°C ...

Page 5

SH8M70 10 V =10V DS Pulsed 1 Ta=-25°C 25°C 0.1 75°C 75°C 0.01 0.01 0 Drain Current : I (A) D Fig.10 Forward Transfer Admittance vs. Drain Current P-ch Electrical characteristic curves 1000 Ciss 100 Coss 10 Crss ...

Page 6

SH8M70 10 Ta=125°C 1 75°C 25°C -25°C V =10V GS Pulsed 0.1 0 Drain Current : -I (A) D Fig.7 Static Drain-Source On-State Resistance vs. Drain Current 1000 100 Reverse Drain Current : ...

Page 7

SH8M70 N-ch Measurement circuit D.U. Fig.13 Switching Time Measurement Circuit (Const.) D.U. Fig.15 Gate ...

Page 8

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