IRF5850TR International Rectifier, IRF5850TR Datasheet

MOSFET 2P-CH 20V 2.2A 6-TSOP

IRF5850TR

Manufacturer Part Number
IRF5850TR
Description
MOSFET 2P-CH 20V 2.2A 6-TSOP
Manufacturer
International Rectifier
Datasheet

Specifications of IRF5850TR

Fet Type
2 P-Channel (Dual)
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
135 mOhm @ 2.2A, 4.5V
Drain To Source Voltage (vdss)
20V
Current - Continuous Drain (id) @ 25° C
2.2A
Vgs(th) (max) @ Id
1.2V @ 250µA
Gate Charge (qg) @ Vgs
5.4nC @ 4.5V
Input Capacitance (ciss) @ Vds
320pF @ 15V
Power - Max
960mW
Mounting Type
Surface Mount
Package / Case
Micro6™(TSOP-6)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF5850TR
Manufacturer:
IR
Quantity:
20 000
Company:
Part Number:
IRF5850TR
Quantity:
15 915
Part Number:
IRF5850TRPBF
Manufacturer:
IR
Quantity:
20 000
Description
l
l
l
l
l
These P-channel MOSFETs from International Rectifier
utilize advanced processing techniques to achieve the
extremely low on-resistance per silicon area. This benefit
provides the designer with an extremely efficient device for
use in battery and load management applications.
This Dual TSOP-6 package is ideal for applications where
printed circuit board space is at a premium and where
maximum
package, the IRF5850 can provide the functionality of two
SOT-23 packages in a smaller footprint. Its unique thermal
design and R
current-handling capability.
Thermal Resistance
www.irf.com
V
I
I
I
P
P
V
T
R
D
D
DM
J,
DS
D
D
GS
@ T
@ T
JA
Ultra Low On-Resistance
Dual P-Channel MOSFET
Surface Mount
Available in Tape & Reel
Low Gate Charge
@T
@T
T
STG
A
A
A
A
= 70°C
= 25°C
= 25°C
= 70°C
functionality is required. With two die per
DS(on)
Drain- Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current 
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Junction and Storage Temperature Range
Maximum Junction-to-Ambient
reduction enables an increase in
Parameter
Parameter
GS
GS
ƒ
@ -4.5V
@ -4.5V
Top View
HEXFET
-55 to + 150
Max.
Max.
130
0.96
0.62
-2.2
-1.8
-9.0
± 12
TSOP-6
-20
7.7
®
R
IRF5850
DS(on)
Power MOSFET
V
DSS
= 0.135
= -20V
PD - 93947A
mW/°C
Units
Units
°C/W
°C
V
A
V
1/13/03
1

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IRF5850TR Summary of contents

Page 1

... Available in Tape & Reel Low Gate Charge l Description These P-channel MOSFETs from International Rectifier utilize advanced processing techniques to achieve the extremely low on-resistance per silicon area. This benefit provides the designer with an extremely efficient device for use in battery and load management applications. ...

Page 2

Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward ...

Page 3

VGS TOP -7.0V -5.0V -4.5V -2.5V -2.0V -1.8V 10 -1.5V BOTTOM -1.2V 1 -1.2V 0.1 20µs PULSE WIDTH 0.01 0 Drain-to-Source Voltage (V) DS Fig 1. Typical Output Characteristics 10 ...

Page 4

1MHz iss rss 400 oss iss 300 200 100 C oss ...

Page 5

Fig 9. Maximum Drain Current Vs. Junction Temperature 1000 100 D = 0.50 0.20 0.10 10 0.05 0.02 0.01 SINGLE PULSE 1 (THERMAL RESPONSE) 0.1 0.00001 0.0001 Fig 10. Typical ...

Page 6

-2.2A 0.12 0.08 2.0 3.0 4.0 5.0 -V GS, Gate -to -Source Voltage (V) Fig 11. Typical On-Resistance Vs. Gate Voltage Charge Fig 13a. Basic Gate ...

Page 7

Temperature ( °C ) Fig 14. Threshold Voltage Vs. Temperature www.irf.com -250µ 0.001 75 100 125 150 ...

Page 8

8 www.irf.com ...

Page 9

Notes : T his part marking information applies to devices produced before 02/26/2001 EXAMPLE: T HIS I3443DV PART NUMBER WAFER LOT NUMBER CODE PART NUMBER CODE REFERENCE SI3443DV 3B = IRF5800 3C = IRF5850 3D ...

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