IRF7752TR International Rectifier, IRF7752TR Datasheet

MOSFET 2N-CH 30V 4.6A 8-TSSOP

IRF7752TR

Manufacturer Part Number
IRF7752TR
Description
MOSFET 2N-CH 30V 4.6A 8-TSSOP
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF7752TR

Fet Type
2 N-Channel (Dual)
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
30 mOhm @ 4.6A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
4.6A
Vgs(th) (max) @ Id
2V @ 250µA
Gate Charge (qg) @ Vgs
9nC @ 4.5V
Input Capacitance (ciss) @ Vds
861pF @ 25V
Power - Max
1W
Mounting Type
Surface Mount
Package / Case
8-TSSOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF7752TRPBF
Manufacturer:
MAXIM
Quantity:
1 001
Part Number:
IRF7752TRPBF
Manufacturer:
IR
Quantity:
20 000
l
l
l
l
l
Description
HEXFET
utilize advanced processing techniques to achieve ex-
tremely low on-resistance per silicon area. This benefit,
combined with the ruggedized device design , that Inter-
national Rectifier is well known for,
with an extremely efficient and reliable device for use
in battery and load management.
The TSSOP-8 package, has 45% less footprint area of the
standard SO-8. This makes the TSSOP-8 an ideal device
for applications where printed circuit board space is at a
premium.
The low profile (<1.1mm) of the TSSOP-8 will allow it to fit
easily into extremely thin application environments such
as portable electronics and PCMCIA cards.
Absolute Maximum Ratings
Thermal Resistance
www.irf.com
V
I
I
I
P
P
V
T
R
D
D
DM
J,
DS
D
D
GS
@ T
@ T
JA
Dual N-Channel MOSFET
Ultra Low On-Resistance
Very Small SOIC Package
Low Profile (< 1.1mm)
Available in Tape & Reel
@T
@T
T
STG
C
C
A
A
®
= 25°C
= 70°C
= 25°C
= 70°C
power MOSFETs from International Rectifier
Drain- Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current 
Linear Derating Factor
Gate-to-Source Voltage
Junction and Storage Temperature Range
Maximum Junction-to-Ambient
Power Dissipation
Power Dissipation
Parameter
Parameter
provides thedesigner
GS
GS
ƒ
@ 10V
@ 10V
2
3
4
1
1 = D1
4 = G1
2 = S 1
3 = S 1
V
30V
DSS
HEXFET
5 = G2
8 = D2
7 = S 2
6 = S 2
0.036@V
0.030@V
-55 to + 150
R
Max.
8
7
6
5
Max.
125
DS(on)
±4.6
±3.7
0.64
±37
± 12
1.0
8.0
30
®
GS
GS
IRF7752
Power MOSFET
max
= 4.5V
= 10V
TSSOP-8
PD -94030A
4.6A
3.9A
mW/°C
Units
Units
I
°C/W
D
W
°C
V
A
V
1
3/25/01

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IRF7752TR Summary of contents

Page 1

... Low Profile (< 1.1mm) Available in Tape & Reel l Description ® HEXFET power MOSFETs from International Rectifier utilize advanced processing techniques to achieve ex- tremely low on-resistance per silicon area. This benefit, combined with the ruggedized device design , that Inter- provides thedesigner national Rectifier is well known for, with an extremely efficient and reliable device for use in battery and load management ...

Page 2

IRF7752 Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source ...

Page 3

PULSE WIDTH Tj = 25°C 0.01 0.01 0 Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 100 T = 150 C ° ° J ...

Page 4

IRF7752 1400 1MHz iss 1200 rss oss ds gd 1000 C iss 800 600 C oss 400 ...

Page 5

T , Case Temperature ( C) C Fig 9. Maximum Drain Current Vs. Case Temperature 1000 100 D = 0.50 0.20 0.10 10 0.05 0.02 0.01 1 SINGLE PULSE (THERMAL ...

Page 6

IRF7752 0.080 0.060 0.040 4.6A 0.020 0.000 2.0 3.0 4.0 5.0 6.0 V GS, Gate -to -Source Voltage (V) Fig 11. Typical On-Resistance Vs. Gate Voltage Charge ...

Page 7

TSSOP-8 Package Outline IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 www.irf.com Data and specifications subject to change without notice. This product has been designed and qualified for the Industrial market. Qualification Standards can ...

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